Parameter
OUTPUT CHARACTERISTICS
Output Voltage Swing
Conditions
R
LOAD
= 500
Ω
R
LOAD
= 150
Ω
R
LOAD
= 1 kΩ
R
LOAD
= 500
Ω
R
LOAD
= 500
Ω
Output Current
Short Circuit Current
Output Resistance
MATCHING CHARACTERISTICS
Dynamic
Crosstalk
Gain Flatness Match
Skew Rate Match
DC
Input Offset Voltage Match
Input Bias Current Match
Open-Loop Gain Match
Common-Mode Rejection Ratio Match
Power Supply Rejection Ratio Match
POWER SUPPLY
Operating Range
Quiescent Current
T
MIN
to T
MAX
T
MIN
to T
MAX
V
S
=
±
5 V to
±
15 V, T
MIN
to T
MAX
V
S
±
5 V
±
5 V
±
15 V
±
15 V
0, +5 V
±
15 V
±
5 V
0, +5 V
±
15 V
Min
3.3
3.2
13.3
12.8
1.5
3.5
50
40
30
Typ
3.8
3.6
13.7
13.4
Max
Unit
±
V
±
V
±
V
±
V
±
V
mA
mA
mA
mA
Ω
Open-Loop
90
8
f = 5 MHz
G = +1, f = 40 MHz
G = –1
T
MIN
to T
MAX
T
MIN
to T
MAX
V
O
=
±10
V, R
L
= 1 kΩ, T
MIN
to T
MAX
V
CM
=
±
12 V, T
MIN
to T
MAX
±
5 V to
±
15 V, T
MIN
to T
MAX
Dual Supply
Single Supply
±
15 V
±
15 V
±
15 V
±
5 V,
±
15 V
±
5 V,
±
15 V
±
15 V
±
15 V
–80
0.2
10
0.5
0.06
0.01
100
100
2
0.8
0.15
dB
dB
V/µs
mV
µA
mV/V
dB
dB
V
V
mA
mA
mA
dB
80
80
±
2.5
+5
±
5 V
±
5 V
±
5 V
14.0
14.0
80
90
±
18
+36
15
15
15
Power Supply Rejection Ratio
*Full
power bandwidth = slew rate/2
π
V
PEAK
.
Specifications subject to change without notice.
ORDERING GUIDE
Model
Temperature
Range
Package
Description
8-Lead Plastic DIP
8-Lead Plastic SOIC
7" Tape and Reel
13" Tape and Reel
T
J
= 150 C
MAXIMUM POWER DISSIPATION – Watts
Package
Option
N-8
SO-8
SO-8
SO-8
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Internal Power Dissipation
2
Plastic DIP (N) . . . . . . . . . . . . . . . . . . See Derating Curves
Small Outline (R) . . . . . . . . . . . . . . . . . See Derating Curves
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .
±
V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .
±
6 V
Output Short Circuit Duration . . . . . . . . See Derating Curves
Storage Temperature Range (N, R) . . . . . . . . –65°C to +125°C
Operating Temperature Range . . . . . . . . . . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Lead Plastic DIP Package:
θ
JA
= 100°C/W
8-Lead SOIC Package:
θ
JA
= 155°C/W
–40°C to +85°C
–40°C to +85°C
2.0
8-LEAD MINI-DIP PACKAGE
1.5
1.0
0.5
8-LEAD SOIC PACKAGE
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70
AMBIENT TEMPERATURE – C
80
90
Figure 3. Maximum Power Dissipation vs.
Temperature for Different Package Types
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD828 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. C
–3–
AD [ ANALOG DEVICES ]
