AD825
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATIONS
Table 3.
Parameter
Supply ꢁoltage
Internal Power Dissipation1
NC
–IN
+IN
1
2
3
4
8
7
6
5
NC
+V
Rating
AD825
S
TOP VIEW
18 ꢁ
OUTPUT
NC
(Not to Scale)
–V
S
Small Outline (R)
See Figure 6
ꢁS
ꢁS
See Figure 6
−6ꢀ°C to +12ꢀ°C
−40°C to +8ꢀ°C
300°C
NC = NO CONNECT
Input ꢁoltage (Common Mode)
Differential Input ꢁoltage
Output Short-Circuit Duration
Storage Temperature Range (R, R-16)
Operating Temperature Range
Figure 4. 8-Lead SOIC
NC
1
16 NC
15 NC
14 NC
NC
NC
2
3
4
5
6
7
8
Lead Temperature Range
(Soldering 10 sec)
AD825
TOP VIEW
(Not to Scale)
–INPUT
+INPUT
13 +V
S
12 OUTPUT
11 NC
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
–V
S
NC
NC
10 NC
9
NC
NC = NO CONNECT
Figure 5. 16-Lead SOIC
2.5
2.0
T
= 150°C
J
1 Specification is for device in free air:
8-lead SOIC package: θJA = 1ꢀꢀ°C/W
16-lead SOIC package: θJA = 8ꢀ°C/W
16-LEAD SOIC PACKAGE
1.5
1.0
0.5
0
8-LEAD SOIC PACKAGE
–50 –40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE (°C)
Figure 6. Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 ꢁ readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. F | Page ꢀ of 12
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