AD823
ABSOLUTE MAXIMUM RATINGS
Table 4
Parameter
Supply Voltage
Internal Power Dissipation
PDIP (N)
SOIC (R)
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range N, R
Operating Temperature Range
Lead Temperature Range
(Soldering, 10 sec)
MAXIMUM POWER DISSIPATION (W)
Rating
36 V
1.3 W
0.9 W
±V
S
±1.2 V
See Figure 4
−65°C to +125°C
−40°C to +85°C
300°C
2.0
8-LEAD PDIP
T
J
= 150°C
1.5
1.0
8-LEAD SOIC
0.5
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
70
80 90
Figure 4. Maximum Power Dissipation vs. Temperature
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Specification is for device in free air.
Table 5. Thermal Resistance
Package Type
8-Lead PDIP
8-Lead SOIC
θ
JA
90
160
Unit
°C/W
°C/W
ESD CAUTION
Rev. B | Page 6 of 20
00901-004
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60
AMBIENT TEMPERATURE (°C)
AD [ ANALOG DEVICES ]
