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AD822AR 参数 Datasheet PDF下载

AD822AR图片预览
型号: AD822AR
PDF下载: 下载PDF文件 查看货源
内容描述: 单电源,轨到轨低功耗FET输入运算放大器 [Single Supply, Rail-to-Rail Low Power FET-Input Op Amp]
分类和应用: 运算放大器
文件页数/大小: 16 页 / 322 K
品牌: AD [ ANALOG DEVICES ]
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AD822–SPECIFICATIONS
AD822
NOTES
1
See standard military drawing for 883B specifications.
2
This is a functional specification. Amplifier bandwidth decreases when the input common-mode voltage is driven in the range (+V
S
– 1 V) to +V
S
.
Common-mode error voltage is typically less than 5 mV with the common-mode voltage set at 1 volt below the positive supply.
3
V
OL
–V
EE
is defined as the difference between the lowest possible output voltage (V
OL
) and the minus voltage supply rail (V
EE
).
V
CC
–V
OH
is defined as the difference between the highest possible output voltage (V
OH
) and the positive supply voltage (V
CC
).
Specifications subject to change without notice.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD822 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Internal Power Dissipation
Plastic DIP (N) . . . . . . . . . . . . . . Observe Derating Curves
Cerdip (Q) . . . . . . . . . . . . . . . . . . Observe Derating Curves
SOIC (R) . . . . . . . . . . . . . . . . . . . Observe Derating Curves
Input Voltage . . . . . . . . . . . . . . (+V
S
+ 0.2 V) to –(20 V + V
S
)
Output Short Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .
±
30 V
Storage Temperature Range (N) . . . . . . . . . –65°C to +125°C
Storage Temperature Range (Q) . . . . . . . . . –65°C to +150°C
Storage Temperature Range (R) . . . . . . . . . –65°C to +150°C
Operating Temperature Range
AD822A/B . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
AD822S . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . +260°C
NOTES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
8-Pin Plastic DIP Package:
θ
JA
= 90°C/Watt
8-Pin Cerdip Package:
θ
JA
= 110°C/Watt
8-Pin SOIC Package:
θ
JA
= 160°C/Watt
ABSOLUTE MAXIMUM RATINGS
1
operation will be restored as soon as the die temperature is
reduced. Leaving the device in the “overheated” condition for
an extended period can result in device burnout. To ensure
proper operation, it is important to observe the derating curves
shown in Figure 24.
While the AD822 is internally short circuit protected, this may not
be sufficient to guarantee that the maximum junction temperature
is not exceeded under all conditions. With power supplies
±12
volts (or less) at an ambient temperature of +25°C or less, if the
output node is shorted to a supply rail, then the amplifier will not
be destroyed, even if this condition persists for an extended period.
ORDERING GUIDE
Temperature
M
odel
1
Package
Description
8-Pin Plastic
Mini-DIP
8-Pin Plastic
Mini-DIP
8-Pin SOIC
8-Pin SOIC
8-Pin SOIC
8-Pin Plastic
Mini-DIP
Die
Package
Option
N-8
N-8
R-8
R-8
R-8
N-8
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C
to +125°C
AD822AN
AD822BN
AD822AR
AD822BR
AD822AR-3V
AD822AN-3V
AD822A Chips
Standard Military
Drawing
2
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD822 is
limited by the associated rise in junction temperature. For plastic
packages, the maximum safe junction temperature is 145°C. For
the cerdip packages, the maximum junction temperature is 175°C.
If these maximums are exceeded momentarily, proper circuit
8-Pin Cerdip Q-8
NOTES
1
Spice model is available on ADI Model Disc.
2
Contact factory for availability.
METALIZATION PHOTOGRAPH
Contact factory for latest dimensions.
Dimensions shown in inches and (mm).
–6–
REV. A