AD8222
OUTLINE DIMENSIONS
4.00
BSC SQ
0.60 MAX
12 13
0.50
0.40
0.30
PIN 1
INDICATOR
16
1
PIN 1
INDICATOR
3.75
BSC SQ
0.65
BSC
TOP VIEW
9
EXPOSED
PAD
4
8
5
2.65
2.50 SQ
2.35
0.25 MIN
1.95 BCS
0.80 MAX
0.65 TYP
BOT
TOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COMPLIANT
TO
JEDEC STANDARDS MO-220-VGGC.
Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-13)
Dimensions are shown in millimeters
4.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
3.75
BCS SQ
0.65
BSC
13
12
16
1
1.95 REF
SQ
9
8
5
4
TOP VIEW
0.80 MAX
0.65 TYP
0.75
0.60
0.50
BOTTOM VIEW
1.00
0.85
0.80
SEATING
PLANE
12° MAX
0.35
0.30
0.25
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
062309-B
COMPLIANT
TO
JEDEC STANDARDS MO-263-VBBC
Figure 55. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad, with Hidden Paddle
CP-16-19
Dimensions shown in millimeters
Rev. A | Page 22 of 24
031006-A
0.30
0.23
0.18
0.05 MAX
0.02 NOM
COPLANARITY
0.20 REF
0.08
AD [ ANALOG DEVICES ]
