AD8072/AD8073
ABSOLUTE MAXIMUM RATINGS
1
MAXIMUM POWER DISSIPATION
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13.2 V
Internal Power Dissipation
2
AD8072 8-Lead Plastic (N) . . . . . . . . . . . . . . . . . . 1.3 Watts
AD8072 8-Lead Small Outline (SO-8) . . . . . . . . . 0.9 Watts
AD8072 8-Lead
µSOIC
(RM) . . . . . . . . . . . . . . . . 0.6 Watts
AD8073 14-Lead Plastic (N) . . . . . . . . . . . . . . . . . 1.6 Watts
AD8073 14-Lead Small Outline (R) . . . . . . . . . . . 1.0 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .
±
V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . .
±
1.25 V
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . .
Observe Power Derating Curves
Storage Temperature Range
N, R, RM Packages . . . . . . . . . . . . . . . . . . –65°C to +125°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Lead Plastic Package:
θ
JA
= 90°C/W
8-Lead SOIC Package:
θ
JA
= 140°C/W
8-Lead
µSOIC
Package:
θ
JA
= 214°C/W
14-Lead Plastic Package:
θ
JA
= 75°C/W
14-Lead SOIC Package:
θ
JA
= 120°C/W
The maximum power that can be safely dissipated by the AD8072
and AD8073 is limited by the associated rise in junction tem-
perature. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition tem-
perature of the plastic, approximately 150°C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
While the AD8072 and AD8073 are internally short circuit pro-
tected, this may not be sufficient to guarantee that the maximum
junction temperature (150°C) is not exceeded under all condi-
tions. To ensure proper operation, it is necessary to observe the
maximum power derating curves shown in Figures 2 and 3.
2.0
8-LEAD MINI-DIP PACKAGE
MAXIMUM POWER DISSIPATION – W
T
J
= 150 C
1.5
8-LEAD SOIC PACKAGE
1.0
ORDERING GUIDE
Model
*AD8072ARM
*AD8072ARM-REEL
*AD8072ARM-REEL7
AD8072JN
AD8072JR
AD8072JR-REEL
AD8072JR-REEL7
AD8073JN
AD8073JR
AD8073JR-REEL
AD8073JR-REEL7
*Brand
Code: HLA
0.5
SOIC
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
Package
Description
8-Lead
µSOIC
13" Reel 8-Lead
µSOIC
7" Reel 8-Lead
µSOIC
8-Lead Plastic DIP
8-Lead SOIC
13" Reel 8-Lead SOIC
7" Reel 8-Lead SOIC
14-Lead Plastic DIP
14-Lead Narrow SOIC
13" Reel 14-Lead SOIC
7" Reel 14-Lead SOIC
Package
Option
RM-8
RM-8
RM-8
N-8
SO-8
SO-8
SO-8
N-14
R-14
R-14
R-14
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60
AMBIENT TEMPERATURE – C
70 80 90
Figure 2. AD8072 Maximum Power Dissipation vs.
Temperature
2.5
T
J
= 150 C
MAXIMUM POWER DISSIPATION – W
2.0
14-LEAD DIP PACKAGE
1.5
14-LEAD SOIC
1.0
0.5
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70
AMBIENT TEMPERATURE – C
80 90
Figure 3. AD8073 Maximum Power Dissipation vs.
Temperature
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8072/AD8073 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. D
AD [ ANALOG DEVICES ]
