AD8055/AD8056
ABSOLUTE MAXIMUM RATINGS
1
MAXIMUM POWER DISSIPATION – Watts
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V
Internal Power Dissipation
2
Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . . . 1.3 W
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . 0.8 W
SOT-23-5 Package (RT) . . . . . . . . . . . . . . . . . . . . . . 0.5 W
microSOIC Package (RM) . . . . . . . . . . . . . . . . . . . . . 0.6 W
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . .
±
V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . .
±
2.5 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range N, R . . . . . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Lead Plastic DIP Package:
θ
JA
= 90°C/W
8-Lead SOIC Package:
θ
JA
= 155°C/W
5-Lead SOT-23-5 Package:
θ
JA
= 240°C/W
8-Lead microSOIC Package:
θ
JA
= 200°C/W
of the plastic, approximately +150°C. Exceeding this limit tem-
porarily may cause a shift in parametric performance due to a
change in the stresses exerted on the die by the package. Exceeding
a junction temperature of +175°C for an extended period can
result in device failure.
While the AD8055/AD8056 are internally short circuit protected,
this may not be sufficient to guarantee that the maximum junc-
tion temperature (+150°C) is not exceeded under all conditions.
To ensure proper operation, it is necessary to observe the maxi-
mum power derating curves.
2.0
8-LEAD PLASTIC DIP PACKAGE
1.5
8-LEAD SOIC
PACKAGE
T
J
= +150 C
1.0
0.5
SOIC
SOT-23-5
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8055/
AD8056 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsu-
lated devices is determined by the glass transition temperature
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE – C
Figure 2. Plot of Maximum Power Dissipation vs.
Temperature for AD8055/AD8056
ORDERING GUIDE
Model
AD8055AN
AD8055AR
AD8055AR-REEL
AD8055AR-REEL7
AD8055ART-REEL
AD8055ART-REEL7
AD8056AN
AD8056AR
AD8056AR-REEL
AD8056AR-REEL7
AD8056ARM
AD8056ARM-REEL
AD8056ARM-REEL7
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Plastic DIP
Small Outline Package (SOIC)
13" Tape and Reel
7" Tape and Reel
13" Tape and Reel
7" Tape and Reel
Plastic DIP
Small Outline Package (SOIC)
13" Tape and Reel
7" Tape and Reel
microSOIC
13" Tape and Reel
7" Tape and Reel
Package Option
N-8
SO-8
SO-8
SO-8
RT-5
RT-5
N-8
SO-8
SO-8
SO-8
RM-8
RM-8
RM-8
Brand Code
H3A
H3A
H5A
H5A
H5A
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8055/AD8056 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. B
–3–
AD [ ANALOG DEVICES ]
