AD8012
MAXIMUM POWER DISSIPATION
MAXIMUM POWER DISSIPATION – W
2.0
T
J
= 150 C
1.5
8-LEAD SOIC
PACKAGE
The maximum power that can be safely dissipated by the AD8012
is limited by the associated rise in junction temperature. The maxi-
mum safe junction temperature for plastic encapsulated devices
is determined by the glass transition temperature of the plastic,
approximately +150°C. Temporarily exceeding this limit may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of +175°C for an extended period can result in
device failure.
The output stage of the AD8012 is designed for maximum load
current capability. As a result, shorting the output to common
can cause the AD8012 to source or sink 500 mA. To ensure
proper operation, it is necessary to observe the maximum power
derating curves. Direct connection of the output to either power
supply rail can destroy the device.
1.0
0.5
8-LEAD
MSOP
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70
AMBIENT TEMPERATURE – C
80 90
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature for AD8012
Test Circuits
750
750
V
OUT
R
L
V
IN
49.9
0.1 F
0.1 F
+
+
10 F
10 F
–V
S
V
IN
53.6
+V
S
0.1 F
0.1 F
R
L
750
750
V
OUT
+
+
+V
S
10 F
10 F
–V
S
Test Circuit 1. Gain = +2
Test Circuit 2. Gain = –1
–4–
REV. B
AD [ ANALOG DEVICES ]
