AD7849
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25°C unless otherwise noted)
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to +17 V
V
CC
to DGND
2
. . . . . . . . . . . . . . . . . . –0.4 V, V
DD
+ 0.4 V or
+7 V (Whichever Is Lower)
V
SS
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to –17 V
V
REF+
to DGND . . . . . . . . . . . . . . . . V
DD
+ 0.4 V, V
SS
– 0.4 V
V
REF–
to DGND . . . . . . . . . . . . . . . . V
DD
+ 0.4 V, V
SS
– 0.4 V
V
OUT
to DGND
3
. . . . . . . . . . . . . . V
DD
+ 0.4 V, V
SS
– 0.4 V or
±
10 V (Whichever Is Lower)
R
OFS
to DGND . . . . . . . . . . . . . . . . . V
DD
+ 0.4 V, V
SS
– 0.4 V
Digital Input Voltage to DGND . . . . . . –0.4 V to V
CC
+ 0.4 V
Input Current to any Pin Except Supplies
4
. . . . . . . . .
±
10 mA
Operating Temperature Range
Commercial/Industrial (A, B, C Versions). . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . . 875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 102°C/W
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . +260°C
SOP Package, Power Dissipation . . . . . . . . . . . . . . . . . 875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 74°C/W
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 71°C/W
Lead Temperature, Soldering (Soldering 10 secs) . . . 260°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
V
CC
must not exceed V
DD
by more than 0.4 V. If it is possible for this to happen
during power-up or power-down (for example, if V
CC
is greater than +0.4 V while
V
DD
is still 0 V), the following diode protection scheme will ensure protection.
V
DD
SD103C
1N5711
1N5712
V
CC
1N4148
V
DD
V
CC
AD7849
3
V
OUT
may be shorted to DGND, +10 V, –10 V, provided that the power dissipation
of the package is not exceeded.
4
Transient currents of up to 100 mA will not cause SCR latch-up.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7849 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
PIN CONFIGURATION
Model
AD7849AN
AD7849BN
AD7849CN
AD7849AR
AD7849BR
AD7849CR
AD7849TQ
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
Resolution
(Bits)
14
16
16
14
16
16
16
Bipolar
INL (LSBs)
±
3
±
8
±
4
±
3
±
8
±
4
±
8
Package
Option
*
N-20
N-20
N-20
R-20
R-20
R-20
Q-20
V
REF+
1
V
REF–
2
V
SS
3
SYNC
4
SCLK 5
20 R
OFS
19 V
OUT
18 NC
17 V
DD
AD7849
16 AGND
V
CC
6 TOP VIEW 15
RSTOUT
(Not to Scale)
14
RSTIN
7
SDOUT
DCEN 8
BIN/COMP
9
DGND 10
13
CLR
12 SDIN
11
LDAC
*N = Plastic DIP; R = SOP (Small Outline Package); Q = Cerdip.
NC = NO CONNECT
–4–
REV. B
AD [ ANALOG DEVICES ]
