AD7714
OUTLINE DIMENSIONS
Dimensions are shown in inches and (mm).
24-Lead Thin Shrink Small Outline Package TSSOP
24-Lead Plastic DIP
(N-24)
(RU-24)
1.228 (31.19)
1.226 (31.14)
0.311 (7.90)
0.303 (7.70)
24
1
13
12
0.260 ± 0.001
(6.61 ± 0.03)
24
13
12
0.32 (8.128)
0.30 (7.62)
PIN 1
0.130 (3.30)
0.128 (7.62)
1
0.011 (0.28)
0.009 (0.23)
0.02 (0.5)
0.019 (0.41) 0.016 (2.28)
0.11 (2.79)
SEATING
PLANE
0.07 (1.78)
0.05 (1.27)
0.006 (0.15)
0.002 (0.05)
PIN 1
15؇
0
0.0433
(1.10)
MAX
NOTES:
0.028 (0.70)
0.020 (0.50)
8؇
0؇
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
SEATING
PLANE
0.0079 (0.20)
0.0035 (0.090)
24-Lead Wide Body SOIC
(R-24)
28-Lead Shrink Small Outline Package SSOP
(RS-28)
0.608 (15.45)
0.596 (15.13)
0.407 (10.34)
0.397 (10.08)
24
1
13
12
28
15
14
0.299 (7.6)
0.291 (7.39)
0.212 (5.38)
0.205 (5.207)
0.414 (10.52)
0.398 (10.10)
0.311 (7.9)
0.301 (7.64)
1
PIN 1
0.096 (204)
0.089 (2.26)
0.03 (0.76)
0.02 (0.51)
0.07 (1.79)
PIN 1
0.066 (1.67)
8؇
0؇
0.019 (0.49)
0.014 (0.35)
0.05 (1.27)
BSC
0.01 (0.254)
0.006 (0.15)
SEATING
PLANE
0.0500 (1.27)
0.0157 (0.40)
0.013 (0.32)
0.009 (0.23)
0.03 (0.762)
8؇
0؇
0.0256 (0.65)
BSC
0.022 (0.558)
0.008 (0.203)
0.002 (0.050)
SEATING
PLANE
0.009 (0.229)
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
0.005 (0.127)
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
–40–
REV. C
ADI [ ADI ]
