AD628
ABSOLUTE MAXIMUM RATINGS
Table 3.
Stresses greater than those listed under Absolute Maximum
Parameter
Rating
Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Supply Voltage
18 V
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature
See Figure 3
120 V1
120 V1
Indefinite
−65°C to +125°C
–40°C to +85°C
300°C
THERMAL CHARACTERISTICS
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
1.6
T
= 150°C
J
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1 When using 12 V supplies or higher (see the Input Voltage Range section).
8-LEAD MSOP PACKAGE
8-LEAD SOIC PACKAGE
MSOP θ (JEDEC; 4-LAYER BOARD) = 132.54°C/W
JA
SOIC θ (JEDEC; 4-LAYER BOARD) = 154°C/W
JA
–60
–40
–20
0
20
40
60
80
100
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. F | Page 7 of 20
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