AD421
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise noted)
PIN CONFIGURATION
DIP and SOIC
DRIVE, BOOST, COMP to COM . . . –0.5 V to V
CC
+ 0.5 V
LOOP RTN to COM . . . . . . . . . . . . . . . . . . . –2 V to + 0.5 V
Digital Input Voltage to COM . . . . . . . –0.5 V to V
CC
+ 0.5 V
Operating Temperature Range
Commercial (B Version) . . . . . . . . . . . . . . – 40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . 260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*
REF OUT1 1
REF OUT2 2
REF IN 3
LV 4
LATCH 5
CLOCK 6
DATA 7
LOOP RTN 8
16 V
CC
15 BOOST
14 COMP
AD421
13 DRIVE
12 C1
TOP VIEW
(NOT TO SCALE)
11 C2
10 C3
9 COM
ORDERING GUIDE
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Model
AD421BN
AD421BR
AD421BRRL
EVAL-AD421EB
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Evaluation Board
Package
Option
*
N-16
R-16
R-16; Reeled SOIC
*N = Plastic DIP, R = SOIC.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. C