AD22100
ABSOLUTE MAXIMUM RATINGS
1
PIN DESCRIPTION
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +10 V
Reversed Continuous Supply Voltage . . . . . . . . . . . . . . –10 V
Operating Temperature . . . . . . . . . . . . . . . . –50°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +160°C
Output Short Circuit to V+ or Ground . . . . . . . . . . Indefinite
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C
1
Mnemonic
V+
V
O
GND
NC
Function
Power Supply Input
Device Output
Ground Pin must be connected to 0 V.
No Connect
PIN CONFIGURATIONS
TO-92
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only; the functional
operation of the device at these or any other conditions above those indicated in the
operation sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE
BOTTOM VIEW
(Not to Scale)
PIN 3
PIN 2
PIN 1
Model/Grade
AD22100 KT
AD22100 KR
AD22100 AT
AD22100 AR
AD22100 ST
AD22100 SR
Guaranteed
Temperature
Range
0°C to 100°C
0°C to 100°C
–40°C to +85°C
–40°C to +85°C
Package
Package
Description* Option
TO-92
SOIC
TO-92
SOIC
TO-92
SO-8
TO-92
SO-8
TO-92
SO-8
N/A
GND
V
O
V+
SOIC
V+ 1
V
O
2
NC 3
8 NC
–50°C to +150°C TO-92
–50°C to +150°C SOIC
N/A
AD22100
7 NC
AD22100KChips +25°C
TOP VIEW
6 NC
(Not to Scale)
5 NC
GND 4
NC = NO CONNECT
*Minimum purchase quantities of 100 pieces for all chip orders.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD22100 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Typical Performance Curves
16
14
250
200
12
θ
JA
–
°C/W
T (T0-92)
(SOIC)
– Sec
10
8
150
τ
6
4
2
0
400
800
FLOW RATE – CFM
1200
T (SOIC)
100
(T0-92)
50
0
400
800
FLOW RATE – CFM
1200
Figure 2. Thermal Response vs. Flow Rate
Figure 3. Thermal Resistance vs. Flow Rate
REV. B
–3–