ADP2325
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Rating
PVIN1, PVIN2, EN1, EN2
SW1, SW2
BST1, BST2
FB1, FB2, SS1, SS2, COMP1, COMP2,
PGOOD1, PGOOD2, TRK1, TRK2, SCFG,
SYNC, RT, MODE
−0.3 V to +22 V
−1 V to +22 V
VSW + 6 V
Boundary Condition
θJA is measured using natural convection on a JEDEC 4-layer
board, and the exposed pad is soldered to the printed circuit
board (PCB) with thermal vias.
−0.3 V to +6 V
INTVCC, VDRV, DL1, DL2
PGND to GND
−0.3 V to +6 V
−0.3 V to +0.3 V
Table 3. Thermal Resistance
Package Type
θJA
Unit
Temperature Range
Operating (Junction)
Storage
32-Lead LFCSP_WQ
32.7
°C/W
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
ESD CAUTION
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 6 of 32
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