1.3 Absolute maximum ratings. 1/
Supply voltage (VPS1, VPS2) ................................................................................... 5.5 V
Input power LOIP, LOIN (relative to 50 Ω) ................................................................. 10 dBm
Input voltage IBBP, IBBN, QBBP, QBBN .................................................................. 0 V to 2.5 V
Power dissipation (P ) .............................................................................................. 340 mW
D
Maximum junction temperature (T ) .......................................................................... +150°C
J
Storage temperature range ........................................................................................ -65°C to +150°C
Lead temperature (soldering 60 seconds) ................................................................. +300°C
Thermal resistance, junction to case (θ ) ................................................................ 38°C/W
JC
Thermal resistance, junction to ambient (θ ) ........................................................... 64°C/W 2/
JA
1.4 Recommended operating conditions.
Supply voltage (VPS1, VPS2) ................................................................................... 2.7 to 5.25 V
Ambient operating temperature range (T ) ............................................................... -55°C to +125°C
A
1.5 Radiation features:
Device type 01:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ................. 100 krads (Si) 3/
Device type 02:
Maximum total dose available (dose rate ≤ 10 mrads(Si)/s) ........................ 50 krads (Si) 4/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
_____
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Measurement taken under absolute worst case conditions of still air.
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A.
4/ For device type 02, radiation end point limits for the noted parameters are guaranteed for the conditions specified in
MIL-STD-883, method 1019, condition D.
SIZE
STANDARD
5962-09227
A
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
REVISION LEVEL
B
SHEET
COLUMBUS, OHIO 43218-3990
3
DSCC FORM 2234
APR 97
ADI [ ADI ]
