1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
C
D
2
3
K
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
CQCC1-N20
CQCC1-N28
GDFP2-F24 or CDFP3-F24
14
14
20
28
24
Dual-in-line
Flat pack
Square leadless chip carrier
Square leadless chip carrier
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (V ) ................................................................................... 18 V dc
CC
Differential input voltage .............................................................................. 1 V dc 2/
Differential input current .............................................................................. 25 mA 2/
Input voltage ................................................................................................ Supply voltage
Output short circuit duration ......................................................................... Continuous
Storage temperature range ......................................................................... -65C to +150C
Lead temperature (soldering, 60 seconds) .................................................. +300C
Power dissipation (P ):
D
Cases C and 2 ......................................................................................... 800 mW
Case D ..................................................................................................... 550 mW
Case 3 ...................................................................................................... 500 mW
Case K ..................................................................................................... 440 mW
Maximum junction temperature (T ) ............................................................ +150C
J
Thermal resistance, junction-to-case ( ) .................................................. See MIL-STD-1835
JC
Thermal resistance, junction-to-ambient ( ):
JA
Cases C and 2 ......................................................................................... 100C/W
Case D ..................................................................................................... 140C/W
Case 3 ...................................................................................................... 110C/W
Case K ..................................................................................................... 69C/W
1.4 Recommended operating conditions.
Ambient operating temperature range (T ) ................................................. -55C to +125C
A
Supply voltage (V ) ................................................................................... 15 V
CC
1.5 Radiation features.
Device types 01 and 02:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) .............. 100 krads(Si) 3/
Device types 03 and 04:
Maximum total dose available (dose rate 10 mrads(Si)/s) .................... 50 krads (Si) 4/
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise
performance. If the differential input voltage exceeds 1 V, the input current should be limited to 25 mA.
3/ Device types 01 and 02 may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate
effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition A.
4/ For device type 03 and 04, radiation end point limits for the noted parameters are guaranteed for the conditions specified
in MIL-STD-883, method 1019, condition D.
SIZE
STANDARD
5962-88565
A
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
REVISION LEVEL
SHEET
COLUMBUS, OHIO 43218-3990
H
3
DSCC FORM 2234
APR 97
ADI [ ADI ]
