AD813
Model
AD813A
Typ
Conditions
VS
Min
Max
Units
MATCHING CHARACTERISTICS
Dynamic
Crosstalk
Gain Flatness Match
DC
G = +2, f = 5 MHz
G = +2, f = 20 MHz
+5 V, +3 V
+5 V, +3 V
–65
0.1
dB
dB
Input Offset Voltage
–Input Bias Current
TMIN–TMAX
TMIN–TMAX
+5 V, +3 V
+5 V, +3 V
0.5
2
3.5
25
mV
µA
POWER SUPPLY
Operating Range
Quiescent Current
2.4
36
V
Per Amplifier
+5 V
+3 V
+5 V
+5 V
+3 V
3.2
3.0
4.0
4.0
5.0
0.6
0.5
mA
mA
mA
mA
mA
TMIN–TMAX
Per Amplifier
Quiescent Current, Powered Down
0.4
0.4
Power Supply Rejection Ratio
Input Offset Voltage
–Input Current
VS = +3.0 V to +30 V
76
0.3
0.005
dB
µA/V
µA/V
+Input Current
DISABLE CHARACTERISTICS
Off Isolation
Off Output Impedance
Channel-to-Channel
Isolation
f = 5 MHz
G = +1
2 or 3 Channel
Mux, f = 5 MHz
+5 V, +3 V
+5 V, +3 V
+5 V, +3 V
–55
13
–65
dB
pF
dB
Turn-On Time
Turn-Off Time
+5 V, +3 V
100
80
ns
ns
TRANSISTOR COUNT
NOTES
111
1Slew rate measurement is based on 10% to 90% rise time in the specified closed-loop gain.
2Single supply differential gain and phase are measured with the ac coupled circuit of Figure 52.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1
ORDERING GUIDE
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V
Internal Power Dissipation2
Temperature
Range
Package
Description
Package
Options
Model
Plastic (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Watts
Small Outline (R) . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . ±VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ±6 V
Output Short Circuit Duration
AD813AN
AD813AR-14
AD813ACHIPS
AD813AR-REEL
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
14-Lead Plastic DIP N-14
14-Lead Plastic SOIC R-14
Die Form
13" REEL
7" REEL
. . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
AD813AR-REEL7
Storage Temperature Range N, R . . . . . . . . –65°C to +125°C
5962-9559601M2A* –55°C to +125°C 20-Lead LCC
Operating Temperature Range
AD813A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
*Refer to official DSCC drawing for tested specifications and pin configuration.
Lead Temperature Range (Soldering 10 sec) . . . . . . . +300°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air:
14-Lead Plastic DIP Package: θJA = 75°C/W
14-Lead SOIC Package: θJA = 120°C/W
REV. B
–5–
ADI [ ADI ]
