AD674B/AD774B
TIMING—STAND ALONE MODE (Figures 4a and 4b)
tHRL
J, K, A, B Grades
Symbol Min Typ Max Min Typ Max Unit
T Grade
R/C
Parameter
tDS
Data Access Time
Low R/C Pulsewidth
STS Delay from R/C
Data Valid After R/C Low tHDR
STS Delay After Data Valid tHS
tDDR
tHRL
tDS
150
200
150 ns
ns
225 ns
ns
50
50
25
STS
25
30
tC
200 600
30 200 600 ns
tHS
High R/C Pulsewidth
tHRH
150
150 ns
tHDR
HIGH–Z
DATA
VALID
Specifications subject to change without notice.
DB11–DB0
DATA VALID
ABSOLUTE MAXIMUM RATINGS*
VCC to Digital Common . . . . . . . . . . . . . . . . . . . 0 to +16.5 V
Flgure 4a. Standalone Mode Timing Low Pulse R/C
VEE to Digital Common . . . . . . . . . . . . . . . . . . . . 0 to –16.5 V
V
LOGIC to Digital Common . . . . . . . . . . . . . . . . . . . 0 to +7 V
Analog Common to Digital Common . . . . . . . . . . . . . . . 1 V
Digital Inputs to Digital Common . . . –0.5 V to VLOGIC +0.5 V
Analog Inputs to Analog Common . . . . . . . . . . . . VEE to VCC
20 VIN to Analog Common . . . . . . . . . . . . . . . . . . . . . . 24 V
REF OUT . . . . . . . . . . . . . . . . . . Indefinite Short to Common
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Momentary Short to VCC
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 175°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 mW
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
R/C
tHRH
tDS
STS
tC
tDDR
tHDR
HIGH–Z
HIGH–Z
DATA
VALID
DB11–DB0
tHL
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Figure 4b. Standalone Mode Timing High Pulse for R/C
ORDERING GUIDE
Conversion
Time (max) (TMIN to TMAX
INL
Package
Description
Package
Option2
Modell
Temperature
)
AD674BJN
AD674BKN
AD674BAR
AD674BBR
AD674BAD
AD674BBD
AD674BTD
AD774BJN
AD774BKN
AD774BAR
AD774BBR
AD774BAD
AD774BBD
AD774BTD
0°C to 70°C
15 µs
15 µs
15 µs
15 µs
15 µs
15 µs
15 µs
8 µs
1 LSB
1/2 LSB
1 LSB
1/2 LSB
1 LSB
1/2 LSB
1 LSB
1 LSB
1/2 LSB
1 LSB
1/2 LSB
Plastic DIP
Plastic DIP
N-28
N-28
R-28
R-28
D-28
D-28
D-28
N-28
N-28
R-28
R-28
D-28
D-28
D-28
0°C to 70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
0°C to 70°C
Plastic SOIC
Plastic SOIC
Ceramic DIP
Ceramic DIP
Ceramic DIP
Plastic DIP
0°C to 70°C
8 µs
Plastic DIP
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
8 µs
Plastic SOIC
Plastic SOIC
Ceramic DIP
Ceramic DIP
Ceramic DIP
8 µs
8 µs
1 LSB
1/2 LSB
1 LSB
8 µs
8 µs
NOTES
1For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices Military
Products Databook or the current AD674B/ AD774B/883B data sheet.
2N = Plastic DIP; D = Hermetic DIP; R = Plastic SOIC.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD674B/AD774B features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. C
ADI [ ADI ]
