REF01/REF02/REF03
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
Rating
Input Voltage
36.0 V
Output Short Circuit Duration
Operating Temperature Range
REF01A, REF02A
REF01CP, REF01CS, REF01E, REF01H,
REF02CP, REF02CS, REF02E, REF02H,
REF03G
Indefinite
Table 3. Thermal Resistance
Package Type
8-lead SOIC (S)
8-lead PDIP (P)
8-lead CERDIP (Z)
TO-99 (J)
θJA
θJC
43
50
26
24
Unit
°C/W
°C/W
°C/W
°C/W
−55°C to +125°C
−40°C to +85°C
130
110
162
170
REF01CJ
0°C to +70°C
Storage Temperature Range
-J, -S, -Z and -RC Packages
-P Package
Junction Temperature Range (TJ)
Lead Temperature (Soldering, 10 sec.)
−65°C to +150°C
−65°C to +125°C
−65°C to +150°C
300°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. K | Page 6 of 20
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