Data Sheet
OP200
ABSOLUTE MAXIMUM RATINGS
Table 5.
THERMAL RESISTANCE
Table 6.
Package Type
Parameter
Rating
1
Supply Voltage
20 V
θJA
θJC
16
37
27
Unit
°C/W
°C/W
°C/W
Differential Input Voltage
Input Voltage
30 V
8-Lead CERDIP (Z Suffix)
8-Lead Plastic DIP (P Suffix)
16-Lead SOIC (S Suffix)
148
96
92
Supply voltage
Continuous
−65°C to +150°C
300°C
Output Short-Circuit Duration
Storage Temperature Range
Lead Temperature (Soldering, 60 sec)
Junction Temperature Range (TJ)
Operating Temperature Range
OP200A
1 θJA is specified for worst-case mounting conditions, that is, θJA is specified for
device in socket for CERDIP and PDIP packages; θJA is specified for device
soldered to printed circuit board for SOIC package.
−65°C to +150°C
ESD CAUTION
−55°C to +125°C
−40°C to +85°C
OP200E, OP200G
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. E | Page 7 of 16
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