AD558
ABSOLUTE MAXIMUM RATINGS*
V
V
V
16
15
14
1
2
3
4
5
6
7
8
(LSB) DB0
DB1
OUT
OUT
OUT
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +18 V
Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . . 0 V to +7.0 V
VOUT . . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Ground
Momentary Short to VCC
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Storage Temperature Range
N/P (Plastic) Packages . . . . . . . . . . . . . . . . –25°C to +100°C
D (Ceramic) Package . . . . . . . . . . . . . . . . . –55°C to +150°C
Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300°C
Thermal Resistance
SENSE
SELECT
DB2
DB3
AD558
TOP VIEW
(Not to Scale)
13 GND
GND
12
DB4
+V
DB5
11
10
9
CC
CS
CE
DB6
(MSB) DB7
Figure 1a. AD558 Pin Configuration (DIP)
Junction to Ambient/Junction to Case
D (Ceramic) Package . . . . . . . . . . . . . . 100°C/W/30°C/W
N/P (Plastic) Packages . . . . . . . . . . . . . 140°C/W/55°C/W
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
3
1
20 19
V
SELECT
4
5
6
18
17
DB2
DB3
NC
OUT
GND
AD558
TOP VIEW
(Not to Scale)
16 NC
DB4
DB5
15 GND
AD558 METALIZATION PHOTOGRAPH
7
8
+V
14
CC
Dimensions shown in inches and (mm).
9
10 11 12 13
NC = NO CONNECT
Figure 1a. AD558 Pin Configuration (DIP)
Figure 1b. AD558 Pin Configuration (PLCC and LCC)
ORDERING GUIDE
Relative Accuracy Full-Scale
Error Max
TMIN to TMAX
Error, Max
TMIN to TMAX
Package
Option2
Model1
Temperature
AD558JN
AD558JP
AD558JD
0°C to +70°C
0°C to +70°C
0°C to +70°C
±1/2 LSB
±1/2 LSB
±1/2 LSB
±2.5 LSB
±2.5 LSB
±2.5 LSB
Plastic (N-16)
PLCC (P-20A)
TO-116 (D-16)
AD558KN
AD558KP
AD558KD
0°C to +70°C
0°C to +70°C
0°C to +70°C
±1/4 LSB
±1/4 LSB
±1/4 LSB
±1 LSB
±1 LSB
±1 LSB
Plastic (N-16)
PLCC (P-20A)
TO-116 (D-16)
AD558SD
AD558TD
–55°C to +125°C
–55°C to +125°C
±3/4 LSB
±3/8 LSB
±2.5 LSB
±1 LSB
TO-116 (D-16)
TO-116 (D-16)
NOTES
1For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices
Military Products Databook or current AD558/883B data sheet.
2D = Ceramic DIP; N = Plastic DIP; P = Plastic Leaded Chip Carrier.
REV. A
–3–
ADI [ ADI ]
