Data Sheet
OP400
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
THERMAL RESISTANCE
Rating
θJA is specified for worst-case mounting conditions, that is, θJA is
specified for device in socket for CERDIP and PDIP packages;
Supply Voltage
Differential Input Voltage
Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
P, Y, S Packages
Lead Temperature (Soldering 60 sec)
Junction Temperature (TJ) Range
Operating Temperature Range
OP400A
20 V
30 V
Supply voltage
Continuous
θ
JA is specified for device soldered to printed circuit board for
SOIC package.
Table 5. Thermal Resistance
Package Type
−65°C to +150°C
300°C
−65°C to +150°C
θJA
94
76
88
θJC
10
33
23
Unit
°C/W
°C/W
°C/W
14-Pin Ceramic DIP (Y)
14-Pin Plastic DIP (P)
16-Pin SOIC (S)
−55°C to +125°C
−25°C to +85°C
0°C to 70°C
OP400E, OP400F
OP400G
OP400H
ESD CAUTION
−40°C to +85°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply to both dice and packaged
parts, unless otherwise noted.
Rev. H | Page 5 of 16
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