ACT88430QJ-T
Rev 1.0, 24-Oct-2018
ABSOLUTE MAXIMUM RATINGS
PARAMETER
VALUE
UNIT
All I/O and Power pins except PGND_B1, PGND_B2, PGND_B3, PGND_B4, GND
Grounds: Any PGND referenced to GND
-0.3 to 6
V
-0.3 to +0.3
V
SW_Bx to PGNDx
-0.3 to VIN + 1
-0.3 to VIN + 0.3
-0.3 to VINx + 0.3
-0.3 to VIN + 0.3
-0.3 to VIO_IN + 0.3
-2 to 1.6
V
V
FB_Bx to PGNDx
OUT_LDOx to PGNDx
EXT_PG
V
V
EXT_EN
V
SW1 HBM ESD (Note 2)
Junction to Ambient Thermal Resistance, QFN (Note3)
Operating Junction Temperature
kV
°C/W
°C
26
-40 to 125
Storage Temperature
-55 to 150
°C
Note1: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may affect
device reliability.
Note2: All other pins meet +/- 2kV HBM ESD
Note3: Measured on Active-Semi Evaluation Kit
RECOMMENDED OPERATING CONDITIONS
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN, VIN_B1, VIN_B2, VIN_B3, VIN_B4, VIN_LDO1,
VIN_LDO23
2.7
5.5
V
VIO_IN
1.62
2.4
5.5
5.5
5.5
V
V
VIN_LDO1
VIN_LDO23
1.62
SW_B2,SW_B3,SW_B4
SW_B1
1.6
3.2
Average lifetime operating current. QFN. (Note 1)
Operating Junction Temperature
A
°C
-40
125
Note1: This temperature range is used for lifetime reliability testing.
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