ACT4530
Rev 1.0, 19-Nov-2018
APPLICATIONS INFORMATION
4) Schottky anode pad and IC exposed pad
should be placed close to ground clips in CLA
applications
PCB Layout Guidance
When laying out the printed circuit board, the
following checklist should be used to ensure proper
operation of the IC.
5) Use “Kelvin” or “4-wire” connection techniques
from the sense resistor pads directly to the CSP
and CSN pins. The CSP and CSN traces
should be in parallel to avoid interference.
1) Arrange the power components to reduce the
AC loop size consisting of CIN, VIN pin, SW pin
and the Schottky diode.
6) Place multiple vias between top and bottom
GND planes for best heat dissipation and noise
immunity.
2) The high power loss components, e.g. the
controller, Schottky diode, and the inductor
should be placed carefully to make the thermal
spread evenly on the board.
7) Use short traces connecting HSB-CHSB-SW
loop.
3) Place input decoupling ceramic capacitor CIN as
close as possible to the VIN pin and power pad.
CIN must be connected to power GND with a
short and wide copper trace.
8) SW pad is noise node switching from VIN to
GND. It should be isolated away from the rest
of circuit for good EMI and low noise operation.
Example PCB Layout
Innovative PowerTM
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