ACT4529
Rev 4, 06-Jan-2017
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
Voltage Feedback Input. Connect to node of the inductor and output capacitor. CSP
and CSN Kevin sense is recommended.
1
CSP
Negative input terminal of output current sense. Connect to the negative terminal of
current sense resistor.
2
3
CSN
PDC
USB-PD Control Pin. floating: 5.1V, pulled high: 12.1V, pulled low: 9.1V. Do not drive
this pin higher than 5V.
Data Line Positive Input. Connected to D+ of attached portable device data line. This
pin passes 8kV HBM ESD.
4
5
DP
Data Line Negative Input. Connected to D- of attached portable device data line. This
pin passes 8kV HBM ESD.
DM
Power Supply Input. Bypass this pin with a 10ìF ceramic capacitor to GND, placed as
close to the IC as possible.
6
7
8
IN
SW
HSB
Power Switching Output to External Inductor.
High Side Bias Pin. This provides power to the internal high-side MOSFET gate driver.
Connect a 22nF capacitor from HSB pin to SW pin.
Ground and Heat Dissipation Pad. Connect this exposed pad to large ground copper
area with copper and vias.
9
GND
ABSOLUTE MAXIMUM RATINGS
PARAMETER
IN to GND
VALUE
-0.3 to 40
-1 to VIN +1
VSW - 0.3 to VSW + 7
-0.3 to +15
-0.3 to +6
-0.3 to +6
46
UNIT
V
SW to GND
V
HSB to GND
V
CSP, CSN to GND
V
PDC to GND
V
All other pins to GND
V
Junction to Ambient Thermal Resistance
Operating Junction Temperature
Storage Junction Temperature
Lead Temperature (Soldering 10 sec.)
°C/W
°C
°C
°C
-40 to 150
-55 to 150
300
: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may
affect device reliability.
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