ACT4529M
Rev 1, 23-Feb-17
APPLICATIONS INFORMATION
4) Schottky anode pad and IC exposed pad
should be placed close to ground clips in CLA
applications
PCB Layout Guidance
When laying out the printed circuit board, the
following checklist should be used to ensure proper
operation of the IC.
5) Use “Kelvin” or “4-wire” connection techniques
from the sense resistor pads directly to the CSP
and CSN pins. The CSP and CSN traces
should be in parallel to avoid interference.
1) Arrange the power components to reduce the
AC loop size consisting of CIN, IN pin, SW pin,
the Schottky diode, and GND
6) Place multiple vias between top and bottom
GND planes for best heat dissipation and noise
immunity.
2) Place input decoupling ceramic capacitor CIN as
close to VIN pin as possible. The GND side of
CIN must be placed as close as possible to to
power GND on the top layer. The traces should
be short and wide.
7) Use short traces connecting HSB-CHSB-SW
loop.
8) SW node is noisy, switching from VIN to GND.
Its size should be minimized and it should be
isolated away from the rest of circuit for good
EMI and low noise operation.
3) The high power loss components, e.g. the
controller, Schottky diode, and the inductor
should be placed carefully to make the thermal
spread evenly on the board.
Example PCB Layout
Innovative PowerTM
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