ACT4527
Rev 1, December 28th, 2015
APPLICATIONS INFORMATION
PC Board Layout Guidance
When laying out the printed circuit board, the
following checklist should be used to ensure proper
operation of the IC.
1) Arrange the power components to reduce the
AC loop size consisting of CIN, VIN pin, SW pin
and the Schottky diode.
2) Place input decoupling ceramic capacitor CIN as
close to VIN pin as possible. CIN is connected
power GND with vias or short and wide path.
3) Use “Kelvin” or “4-wire” connection techniques
from the sense resistor pads directly to the CSP
and CSN pins.
4) Use copper plane and thermal vias for GND for
best heat dissipation and noise immunity.
5) Use short trace connecting HSB-CHSB-SW loop.
6) SW pad is noise node switching from VIN to
GND. It should be isolated away from the rest
of circuit for good EMI and low noise operation.
Innovative PowerTM
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