ACT4523A
Rev 0, 25-Jul-13
PACKAGE OUTLINE
SOP-8EP PACKAGE OUTLINE AND DIMENSIONS
DIMENSION IN
MILLIMETERS
DIMENSION IN
INCHES
SYMBOL
MIN
MAX
1.700
0.100
1.550
0.510
0.250
5.100
3.402
4.000
6.200
2.513
MIN
MAX
A
A1
A2
b
1.350
0.000
1.350
0.330
0.170
4.700
3.202
3.800
5.800
2.313
0.053 0.067
0.000 0.004
0.053 0.061
0.013 0.020
0.007 0.010
0.185 0.200
0.126 0.134
0.150 0.157
0.228 0.244
0.091 0.099
0.050 TYP
c
D
D1
E
E1
E2
e
1.270 TYP
0.400
0°
1.270
8°
0.016 0.050
L
0°
8°
θ
Note:
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per end.
2. Dimension E does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each
product to make sure that it is suitable for their applications. Active-Semi products are not intended or authorized for use
as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of
the use of any product or circuit described in this datasheet, nor does it convey any patent license.
Active-Semi and its logo are trademarks of Active-Semi, Inc. For more information on this and other products, contact
sales@active-semi.com or visit http://www.active-semi.com.
is a registered trademark of Active-Semi.
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