ACT2813/ACT2813C
Rev 2, 19-May-15
PC Board Layout Guidance
When laying out the printed circuit board, the
following checklist should be used to ensure proper
operation of the IC.
Sense from sense resistor R1 and R2 to CSP
and CSN pins. 22uF decoupling capacitor is
added close to VBAT pin.
1. Arrange the power components to reduce the
AC loop size, VIN pin, Vout pin, SW pin and the
schottky diode.
5. Place the ceramic capacitor C2 and D1 as
close to VOUT and PGND as possible, SW
goes under the C2 (recommend C2 to use 1206
size). SW pad is a noisy node switching. It
should be isolated away from the rest of circuit
for good EMI and low noise operation.
2. Place input decoupling ceramic capacitor C1
and R9 as close to VIN pin as possible.
Resistor R9 is added in series with capacitor
C1 to damp the potential LC resonance .
6. RC snubber is recommended to add across SW
to PGND to reduce EMI noise.
A demo board PCB layout example is shown in the
figure 16.
3. Use copper plane for power GND for best heat
dissipation and noise immunity.
4. Place CSP and CSN capacitor C7 (10nF) close
to CSP and CSN pin as possible, use Kevin
Figure 16.
PCB Layout
Top Layer
Bottom Layer
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