PLUS
ProASIC
Flash Family FPGAs
Ordering Information
_
APA1000
F
FG
G
1152
I
Application (Ambient Temperature Range)
Blank = Commercial (0˚C to +70˚C)
I = Industrial (-40˚C to +85˚C)
PP = Pre-production
ES = Engineering Silicon (Room Temperature Only)
M = Military (-55˚C to 125˚C)
B
= MIL-STD-883 Class B
Package Lead Count
Lead-free packaging
Blank = Standard Packaging
G = RoHS Compliant (Green) Packaging
Package Type
=
=
=
=
=
=
=
TQ
PQ
FG
BG
CQ
CG
LG
Thin Quad Flat Pack (0.5mm pitch)
Plastic Quad Flat Pack (0.5mm pitch)
Fine Pitch Ball Grid Array (1.0mm pitch)
Plastic Ball Grid Array (1.27mm pitch)
Ceramic Quad Flat Pack (1.05mm pitch)
Ceramic Column Grid Array (1.27mm pitch)
Land Grid Array (1.27 mm pitch)
Speed Grade
=
Blank
F
Standard Speed
= 20% Slower than Standard
Part Number
APA075 = 75,000 Equivalent System Gates
APA150 = 150,000 Equivalent System Gates
APA300 = 300,000 Equivalent System Gates
APA450 = 450,000 Equivalent System Gates
APA600 = 600,000 Equivalent System Gates
APA750 = 750,000 Equivalent System Gates
APA1000 = 1,000,000 Equivalent System Gates
Plastic Device Resources
User I/Os2
Commercial/Industrial
PBGA FBGA FBGA FBGA FBGA FBGA
Military
TQFP
TQFP
PQFP
FBGA
CQFP
CQFP CCGA/LGA
Device 100-Pin 144-Pin 208-Pin 456-Pin 144-Pin 256-Pin 484-Pin 676-Pin 896-Pin 1152-Pin 208-Pin 352-Pin 624-Pin
APA075
APA150
APA300
APA450
APA600
APA750
APA1000
Notes:
66
66
107
158
158
158
158
158
158
158
100
100
100
100
242
290
344
356
356
356
186 3
186 3
186 3
186 3
158
158
158
248
248
248
344 3
370 3
454
454
440
440
562 4
642 4
712 4
1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid
Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array
2. Each pair of PECL I/Os is counted as one user I/O.
3. FG256 and FG484 are footprint-compatible packages.
4. FG896 and FG1152 are footprint-compatible packages.
ii
v5.2
ACTEL [ Actel Corporation ]
