™
A C T
1 S e r i e s F P G A s
A C T 1 A r r a y P e r f o r m a n c e
source 10 mA at TTL levels. See Electrical Specifications for
additional I/O buffer specifications.
T e m p e r a t u r e a n d Vo lt a g e E ffe c t s
Worst-case delays for ACT 1 arrays are calculated in the same
manner as for masked array products. A typical delay
parameter is multiplied by a derating factor to account for
temperature, voltage, and processing effects. However, in an
ACT 1 array, temperature and voltage effects are less
dramatic than with masked devices. The electrical
characteristics of module interconnections on ACT 1 devices
remain constant over voltage and temperature fluctuations.
D e v i c e O r g a n i z a t i o n
ACT 1 devices consist of a matrix of logic modules arranged in
rows separated by wiring channels. This array is surrounded
by a ring of peripheral circuits including I/O buffers,
testability circuits, and diagnostic probe circuits providing
real-time diagnostic capability. Between rows of logic
modules are routing channels containing sets of segmented
metal tracks with PLICE antifuses. Each channel has 22
signal tracks. Vertical routing is permitted via 13 vertical
tracks per logic module column. The resulting network allows
arbitrary and flexible interconnections between logic
modules and I/O modules.
As a result, the total derating factor from typical to
worst-case for a standard speed ACT 1 array is only 1.19 to 1,
compared to 2 to 1 for a masked gate array.
Lo g ic Mo d u le S iz e
Logic module size also affects performance. A mask
programmed gate array cell with four transistors usually
implements only one logic level. In the more complex logic
module (similar to the complexity of a gate array macro) of
an ACT 1 array, implementation of multiple logic levels
within a single module is possible. This eliminates interlevel
wiring and associated RC delays. The effect is termed “net
compression.”
P r o b e P i n
ACT 1 devices have two independent diagnostic probe pins.
These pins allow the user to observe any two internal signals
by entering the appropriate net name in the diagnostic
software. Signals may be viewed on a logic analyzer using
Actel’s Actionprobe® diagnostic tools. The probe pins can
also be used as user-defined I/Os when debugging is finished.
O r d e r i n g I n f o r m a t i o n
A1010
B
–
2
PL
84
C
Application (Temperature Range)
C = Commercial (0 to +70°C)
I
= Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
B = MIL-STD-883
Package Lead Count
Package Type
PL = Plastic J-Leaded Chip Carriers
PQ = Plastic Quad Flatpacks
CQ = Ceramic Quad Flatpack
PG = Ceramic Pin Grid Array
VQ = Very Thin Quad Flatpack
Speed Grade
Blank = Standard Speed
–1
–2
–3
= Approximately 15% faster than Standard
= Approximately 25% faster than Standard
= Approximately 35% faster than Standard
Die Revision
B = 1.0 micron CMOS Process
Part Number
A1010 = 1200 Gates (5 V)
A1020 = 2000 Gates (5 V)
A10V10 = 1200 Gates (3.3 V)
A10V20 = 2000 Gates (3.3 V)
1 -2 8 5
ACTEL [ Actel Corporation ]
