c. Subgroup 4 (C and C
IN OUT
measurements) shall be measured only for initial qualification and after any process or
design changes which may affect input or output capacitance. Capacitance shall be measured between the designated
terminal and GND at a frequency equal or less than 1 MHz. Sample size is five (5) devices with no failures, and all
input and output terminals tested.
d. O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which may
affect the performance of the device. For device class M procedures and circuits shall be maintained under document
revision level control by the manufacturer and shall be made available to the preparing activity or acquiring activity
upon request. For device classes Q and V, the procedures and circuits shall be under the control of the device
manufacturer's technical review board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the
preparing activity or acquiring activity upon request. Testing shall be on all pins, on 5 devices with zero failures.
Latch-up test shall be considered destructive. Information contained in JEDEC Standard EIA/JESD 78 may be used
for reference.
e. Programmed device (see 3.2.3.2) - For device class M, subgroups 7, 8A, and 8B tests shall consist of verifying the
functionality of the device. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of
the device. These tests shall have been fault graded in accordance with MIL-STD-883, test method 5012 (see 1.6
herein).
f. Unprogrammed devices shall be tested for programmability and dc and ac performance compliance to the
requirements of group A, subgroups 1 and 7.
(1) A sample shall be selected from each wafer lot to satisfy programmability requirements. Eight devices shall be
submitted to programming (see 3.2.3.1). If any device fails to program, the lot shall be rejected. At the
manufacturer's option, the sample may be increased to 18 total devices with no more than two total device failures
allowable.
(2) These eight devices shall also be submitted to the requirements of the specified tests of group A, subgroups 1 and
7. If any device fails, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 18
total devices with no more than two total device failures allowable.
(3a) Eight devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9 for
binning circuit delay only. If any device fails, the lot shall be rejected. At the manufacturer's option, the sample may
be increased to 18 total devices with no more than two total device failures allowable.
(3b) If the binning circuit is tested on 100 percent of the products, then the above requirement (3A) is met.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005.
b.
T = +125°C, minimum.
A
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-
883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a. End-point electrical parameters shall be as specified in table IIA herein.
SIZE
STANDARD
5962-92156
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
J
SHEET
8
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
