MIL-PRF-38535K
6.7 Subject term (key word) listing.
Application specific integrated circuit (ASIC)
Computer-aided design (CAD)
Design-for-test (DFT)
Design rule check (DRC)
Electrical rule check (ERC)
Enhanced low dose rate sensitivity (ELDRS)
Electrostatic discharge (ESD)
Failure analysis (FA)
Joint Test Action Group (JTAG)
Linear energy transfer threshold (LETTH
Mean time to failure (MTTF)
Parametric monitor (PM)
)
Post irradiated end-point parameter limits (PIPL)
Quality management (QM)
Radiation hardness assurance (RHA)
Radiation hardness assurance capability level (RHACL)
Single event effects (SEE)
Standard evaluation circuit (SEC)
Statistical process control (SPC)
Technology characterization vehicle (TCV)
Technology conformance inspection (TCI)
Technology Review Board (TRB)
Time dependent dielectric breakdown (TDDB)
Very high speed integrated circuit (VHSIC)
VHSIC hardware description language (VHDL)
Package integrity demonstration test plan (PIDTP)
Multi-product wafer (MPW)
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ACTEL [ Actel Corporation ]
