MIL-PRF-38535K
APPENDIX B
B.4.3 Technology conformance inspection (TCI) for class V and class Y. In addition to the TCI tests specified in the main body of
this specification (see table II to table V), unless otherwise noted herein, the TCI requirements listed below apply on each lot of
deliverable devices. The group and table references correspond to those contained herein. These requirements do not replace the
normal TCI testing requirements of this specification. The following additions or exceptions apply to the TCI tests specified in the
main body of this specification.
Table III, group A electrical test shall be performed on each deliverable lot using actual devices. For those lots having a
quantity of less than 116 devices, the tests shall be imposed on a 100 percent basis and the lot accepted on zero test
rejects. If a microcircuit fails a group A test parameter as a result of faulty test equipment or operator error, the cause shall
be determined and documented, and corrective action shall be implemented and documented. The affected lot may then be
accepted by being resubmitted to the failed test parameters using a 116/0 or 100 percent/0 sample.
If a microcircuit fails a group A test due to a previously unscreened parameter, the affected lot may be accepted by
screening the lot 100 percent for the failed parameters, and resubmitting a group A sample to the failed subgroup using a
116/0 or 100 percent/0 sample. Any failures resulting from the second screen shall count toward the lot total percent
defective. PDA shall be in accordance with table III herein or TM 5005 of MIL-STD-883 for class level S.
Group A electrical tests are not required to be performed when the following conditions are met:
(1) The final electrical tests of the 100 percent screening test (see table I) includes all required group A tests (see
table III).
(2) The test setup and test conditions are verified by a certified monitor other than the test operator.
(3) Analysis of failures does not indicate a generic or lot related reliability problem.
Note: In no event shall the absence of separate group A testing result in a failure to satisfy the data requirements of section
B.3.1.1c.
a. Table II, group B, shall be performed on actual devices except as noted herein. Empty device packages or electrical
rejects may be used for subgroups B-1 and B-3, and electrical rejects that have been subjected to the 100 percent
screening tests may be used for subgroup B-2. The electrical rejects and empty packages shall have been produced under
equivalent conditions as the production lot. The TRB shall determine that the intent of the tests is not violated.
For classes V and Y exceptions and additional requirements are as follows:
1. Resistance to solvents test is not required for laser marked device.
2. Device packages with lid/heat sink attached on the back side of a flip chip die require a lid shear or lid torque test.
Manufacturers shall submit test procedures of lid shear test for approval of QA. Lid torque test shall be performed
in accordance with TM 2024.
3. Device with solder terminations:
(i) For ball grid array (BGA) packages, ball shear test shall be performed in accordance with JESD22-B117.
(ii) For column grid array (CGA) packages, solder column pull test shall be performed in accordance with
TM 2038.
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ACTEL [ Actel Corporation ]
