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    5962-0822404QZA 参数 Datasheet PDF下载

    5962-0822404QZA图片预览
    型号： 5962-0822404QZA
    PDF下载： 下载PDF文件 查看货源
    内容描述： [Field Programmable Gate Array, 4000000 Gates, CMOS, CPGA1272, CERAMIC, CGA-1272]
    分类和应用： 栅可编程逻辑
    文件页数/大小： 217 页 / 1554 K
    品牌： ACTEL [ Actel Corporation ]
     浏览型号5962-0822404QZA的Datasheet PDF文件第4页浏览型号5962-0822404QZA的Datasheet PDF文件第5页浏览型号5962-0822404QZA的Datasheet PDF文件第6页浏览型号5962-0822404QZA的Datasheet PDF文件第7页浏览型号5962-0822404QZA的Datasheet PDF文件第9页浏览型号5962-0822404QZA的Datasheet PDF文件第10页浏览型号5962-0822404QZA的Datasheet PDF文件第11页浏览型号5962-0822404QZA的Datasheet PDF文件第12页  
    MIL-PRF-38535K
    CONTENTS
    PARAGRAPH
    PAGE
    A.4.5.4.1 Group C sample selection............................................................................................................................ 81
    A.4.5.4.1.1 Microcircuit group assignments ................................................................................................................ 81
    A.4.5.4.1.2 Product acceptable for delivery................................................................................................................. 81
    A.4.5.5 Group D inspection ......................................................................................................................................... 81
    A.4.5.5.1 Group D sample selection............................................................................................................................ 84
    A.4.5.5.2 Incoming vendor material control program................................................................................................... 84
    A.4.5.6 Group E inspection ......................................................................................................................................... 84
    A.4.5.6.1 Group E sample selection ............................................................................................................................ 84
    A.4.5.7 End-point tests for groups B, C, and D (and E if applicable) inspections ........................................................ 84
    A.4.5.8 Nonconformance ............................................................................................................................................ 85
    A.4.5.8.1 Group B failure............................................................................................................................................. 85
    A.4.5.8.2 Alternate group B failure .............................................................................................................................. 85
    A.4.5.8.3 Group C failure ............................................................................................................................................ 86
    A.4.5.8.4 Group D failure ............................................................................................................................................ 86
    A.4.6 Screening........................................................................................................................................................... 86
    A.4.6.1 Burn-in ............................................................................................................................................................ 86
    A.4.6.1.1 Lots and sublots resubmitted for burn-in ...................................................................................................... 86
    A.4.6.1.2 Burn-in acceptance criteria .......................................................................................................................... 87
    A.4.6.1.2.1 Failure analysis of burn-in screen failures for class level S devices ......................................................... 87
    A.4.6.2 External visual screen ..................................................................................................................................... 87
    A.4.6.3 Particle impact noise detection (PIND) test for class level S devices ............................................................. 87
    A.4.6.4 Lead forming ................................................................................................................................................... 87
    A.4.6.5 Nondestructive bond pull test for class level S devices................................................................................... 87
    A.4.7 Test results ........................................................................................................................................................ 88
    A.4.7.1 Screening test data for class level S microcircuits .......................................................................................... 88
    A.4.8 Quality assurance program ................................................................................................................................ 88
    A.4.8.1 Manufacturer certification................................................................................................................................ 88
    A.4.8.1.1 Design, processing, manufacturing, and testing instructions ....................................................................... 89
    A.4.8.1.1.1 Conversion of customer requirements into manufacturer's internal instructions ....................................... 89
    A.4.8.1.1.2 Personnel training and testing .................................................................................................................. 89
    A.4.8.1.1.3 Inspection of incoming materials and utilities, and of work in-process ...................................................... 89
    A.4.8.1.1.4 Quality control operations ......................................................................................................................... 89
    A.4.8.1.1.5 Quality assurance operations ................................................................................................................... 89
    A.4.8.1.1.6 Design, processing, manufacturing equipment, and materials instructions............................................... 91
    A.4.8.1.1.7 Cleanliness and atmosphere control in work areas .................................................................................. 91
    A.4.8.1.1.8 Design, material, and process change control .......................................................................................... 91
    A.4.8.1.1.9 Tool, gauge, and test equipment maintenance and calibration ................................................................. 91
    A.4.8.1.1.10 Failure and defect analysis and feedback ............................................................................................... 92
    A.4.8.1.1.11 Corrective action and evaluation............................................................................................................. 92
    A.4.8.1.1.12 Incoming, in-process, and outgoing inventory control ............................................................................. 92
    A.4.8.1.1.13 Schematics ............................................................................................................................................. 92
    A.4.8.1.1.14 ESD handling control program ................................................................................................................ 92
    A.4.8.1.2 Records to be maintained ............................................................................................................................ 92
    A.4.8.1.2.1 Personnel training and testing .................................................................................................................. 94
    A.4.8.1.2.1.1 Training of operators and inspectors...................................................................................................... 94
    A.4.8.1.2.2 Inspection operations ................................................................................................................................ 94
    A.4.8.1.2.3 Failure and defect reports and analyses ................................................................................................... 94
    A.4.8.1.2.4 Initial documentation and subsequent changes in design, materials, or processing ................................. 94
    A.4.8.1.2.5 Equipment calibrations.............................................................................................................................. 95
    A.4.8.1.2.6 Process, utility, and material controls........................................................................................................ 95
    A.4.8.1.2.7 Product lot identification ............................................................................................................................ 95
    A.4.8.1.2.8 Product traceability ................................................................................................................................... 95
    A.4.8.1.3 Quality assurance program plan .................................................................................................................. 95
    A.4.8.1.3.1 Functional block organization chart .......................................................................................................... 96
    A.4.8.1.3.2 Examples of manufacturing flowchart ....................................................................................................... 96
    viii

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