MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
A.3.4.1.4 Qualification to ESD classes........................................................................................................................58
A.3.4.2 Changes and notification of change to product or quality assurance program ...............................................59
A.3.4.2.1 Discontinuation of products..........................................................................................................................59
A.3.4.3 Screening........................................................................................................................................................59
A.3.4.4 Quality conformance inspection (QCI)............................................................................................................59
A.3.4.5 Wafer lot acceptance......................................................................................................................................59
A.3.4.6 Traceability .....................................................................................................................................................59
A.3.4.6.1 Lot travelers.................................................................................................................................................59
A.3.4.7 Government source inspection .......................................................................................................................59
A.3.5 Design and construction ....................................................................................................................................59
A.3.5.1 Package..........................................................................................................................................................60
A.3.5.1.1 Polymeric materials......................................................................................................................................60
A.3.5.1.2 Package configurations................................................................................................................................60
A.3.5.2 Metals.............................................................................................................................................................60
A.3.5.3 Other materials ...............................................................................................................................................60
A.3.5.4 Design documentation....................................................................................................................................60
A.3.5.4.1 Die topography ............................................................................................................................................60
A.3.5.4.2 Die intraconnection pattern..........................................................................................................................60
A.3.5.4.3 Die to terminal interconnection ....................................................................................................................61
A.3.5.4.4 Schematic diagrams ....................................................................................................................................61
A.3.5.5 Internal conductors .........................................................................................................................................61
A.3.5.5.1 Metallization thickness.................................................................................................................................63
A.3.5.5.2 Internal wire size and material .....................................................................................................................63
A.3.5.5.3 Internal lead wires........................................................................................................................................64
A.3.5.5.4 Verification of glassivation layer integrity.....................................................................................................64
A.3.5.6 Package element material and finish..............................................................................................................64
A.3.5.6.1 Package material.........................................................................................................................................64
A.3.5.6.2 Lead or terminal material.............................................................................................................................65
A.3.5.6.3 Microcircuit finishes......................................................................................................................................65
A.3.5.6.3.1 Finish thickness measurements................................................................................................................65
A.3.5.6.3.2 Lead finish ................................................................................................................................................66
A.3.5.6.3.3 Package element (other than lead or terminal) finish................................................................................66
A.3.5.6.3.4 Hot solder dip............................................................................................................................................66
A.3.5.6.3.5 Tin-lead plate............................................................................................................................................67
A.3.5.7 Die plating and mounting................................................................................................................................67
A.3.5.8 Glassivation ....................................................................................................................................................69
A.3.5.9 Die thickness ..................................................................................................................................................70
A.3.5.10 Laser scribing ...............................................................................................................................................70
A.3.5.11 Internal lead separation for class level S devices .........................................................................................70
A.3.6 Marking of microcircuits.....................................................................................................................................70
A.3.6.1 Index point ......................................................................................................................................................70
A.3.6.2 PIN..................................................................................................................................................................71
A.3.6.2.1 Military designator........................................................................................................................................71
A.3.6.2.2 RHA designator ...........................................................................................................................................71
A.3.6.2.3 Device specification.....................................................................................................................................71
A.3.6.2.4 Device type..................................................................................................................................................71
A.3.6.2.5 Device class.................................................................................................................................................71
A.3.6.2.6 Case outline.................................................................................................................................................71
A.3.6.2.7 Lead finish ...................................................................................................................................................71
A.3.6.2.8 Drawing designator......................................................................................................................................71
A.3.6.3 Identification codes.........................................................................................................................................72
A.3.6.3.1 Class level B die fabrication date code........................................................................................................72
A.3.6.3.2 Inspection lot identification code for class levels S and B............................................................................72
A.3.6.4 Manufacturer's identification ...........................................................................................................................72
A.3.6.5 Manufacturer's designating symbol.................................................................................................................72
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ACTEL [ Actel Corporation ]
