MIL-PRF-38535K
APPENDIX A
A.3.1.3.16 Rework. Any processing or reprocessing operation documented in accordance with A.4.8.1.1.6h
herein, other than testing, applied to an individual device, or part thereof, and performed subsequent to the
prescribed non repairing manufacturing operations which are applicable to all devices of that type at that stage.
A.3.1.3.17 Final seal. That manufacturing operation which completes the enclosure of a device so that further
internal processing cannot be performed without disassembling the device.
A.3.1.3.18 Acquiring activity. The organizational element of the Government which contracts for articles, supplies,
or services; or it may be a contractor or subcontractor when the organizational element of the Government has given
specific written authorization to such contractor or subcontractor to serve as agent of the acquiring activity. A
contractor or subcontractor serving as agent of the acquiring activity shall not have the authority to grant waivers,
deviations, or exceptions to this appendix unless specific written authorization to do so has also been given by the
Government organization (e.g., preparing activity).
A.3.1.3.19 Qualifying activity. The organizational element of the Government that grants certification and
qualification for the specific associated end-product in accordance with this appendix and the applicable device
specification or drawing. For non-JAN product built in accordance with this appendix, the qualifying activity shall be
either the acquiring activity or quality organization within the manufacturer's company that is independent of the
group(s) responsible for device production screening and marketing or by an independent organization outside the
manufacturer's company.
A.3.1.3.20 Device type. The term device type refers to a single specific microcircuit configuration. Samples of the
same device type will be electrically and functionally interchangeable with each other at the die or substrate level
even though made by different manufacturers using different mechanical layouts and possibly different materials.
The electrical and environmental limits will be the same (but not necessarily the inherent reliability) for a given device
type even though the device class, the case outline, the lead finish, the lot identification code, and the manufacturer
may be different.
A.3.1.3.21 Die type. A microcircuit manufactured using the same physical size, materials, topology, mask set, and
process flow, on a single fabrication line.
A.3.1.3.22 Antistatic. An antistatic material resists triboelectric charging upon contact and separation with another
material. Plastic materials impregnated with antistatic agents (antistats) are antistatic if their surface resistivity is
between 109 and 1014 ohms/square.
A.3.1.3.23 Conductive. A conductive material is one capable of electrostatic field shielding and having a volume
resistivity of 103 ohm-cm maximum or a surface resistivity less than 105 ohms/square.
A.3.1.3.24 Insulating. An insulating material is defined as having a volume resistivity of 1012 ohm-cm minimum, or
a surface resistivity of 1014 ohms/square minimum.
A.3.1.3.25 Dissipative. A dissipative material is defined as having a surface resistivity between 105 and 109
ohms/square.
A.3.1.3.26 Radiation hardness assurance (RHA). The portion of product assurance which insures that parts
continue to perform as specified or degrade in a specified manner when subjected to the specified radiation
environmental stress.
A.3.1.3.27 Electrostatic discharge (ESD) sensitivity. Electrostatic discharge sensitivity is defined as the level of
susceptibility of a device to damage by static electricity. The level of susceptibility of a device is found by ESD
classification testing and is used as the basis for assigning an ESD class (see A.3.4.1.4).
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ACTEL [ Actel Corporation ]
