MIL-PRF-38535K
TABLE II. Group B tests (Mechanical and environmental test) . – Continued.
Group B tests for QML microcircuits
(MIL-PRF-38535)
Group B tests for class level B and S microcircuits
(TM 5005 of MIL-STD-883)
Subgroups
1/
Class Q
Class V
Class Y
Class level B
Class level S
Subgroup 3
sample size 22(0)
(22 leads from 3 devices) +245°C ±5°C
8/
Solderability TM 2003 Solderability TM 2003
Solderability TM 2003
solder temperature
+245°C ±5°C
Solderability TM 2003
solder temperature
+245°C ±5°C
Solderability TM 2003
solder temperature
+245°C ±5°C
solder temperature
solder temperature
+245°C ±5°C
Subgroup 4
sample size 45(0)
3/
For BGA/CGA packages:
For BGA/CGA packages:
a. Lead integrity TM 2004 9/
(Test condition B2, lead fatigue)
(i) Ball shear test for BGA
package - JESD22-B117
(45 balls from 2 devices
minimum)
(i) Ball shear test for BGA
package - JESD22-B117
(45 balls from 2 devices
minimum)
b. Seal test TM 1014
as applicable
(1) Fine leak
(2) Gross leak
(ii) Solder column pull test for
CGA package – TM 2038
(45 columns from 2 devices
minimum)
(ii) Solder column pull test for
CGA package - TM 2038
(45 columns from 2 devices
minimum)
c. Lid torque TM 2024 10/
as applicable
d. For BGA/CGA packages:
(i) Ball shear test for BGA
package - JESD22-B117
(45 balls from 2 devices
minimum)
(ii) Solder column pull test for
CGA package – TM 2038
(45 columns from 2 devices
minimum)
25
ACTEL [ Actel Corporation ]
