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5962-0150805QYX 参数 Datasheet PDF下载

5962-0150805QYX图片预览
型号: 5962-0150805QYX
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 32000 Gates, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
3.6.8 QML marked product. For QML certified and qualified manufacturers and manufacturers who have been granted  
transitional certification (see H.3.3), standard product (Joint Army Navy (JAN), class M SMDs, and military temperature range  
class B data book product), produced on a QML flow may be marked with the "Q" or "QML" certification mark. This allowance  
applies to contractor prepared drawings covering standard product only if the drawing was released prior to 31 December  
1993 or the date the manufacturer becomes QML whichever is the later date, and the part is marked with the standard part  
number. A list of the manufacturer's military temperature range product to be included under QML shall be submitted to the  
QA for approval. Contractor prepared drawings written for nonstandard parts may not be marked with a "Q" or "QML". The  
only exception to this requirement is an altered item drawing required by a device specification or SMD.  
Only parts covered by a MIL-M-38510 device specification, an SMD, or generic parts that have been grandfathered (a list of  
eligible devices shall be submitted to DLA Land and Maritime-VA or DLA Land and Maritime-VQ for review) shall be listed on  
QML-38535. After 31 December 93, new QML products, which are marked with a "Q" or "QML" certification mark, shall be  
documented on an SMD (see 3.5). Any device that is not processed in compliance with the provisions of MIL-PRF-38535 shall  
not be claimed to be compliant. Non-compliant products shall not contain “QML”, “QML V”, “QML Yor any variant thereof  
within the vendor part number or within any marking located on the package.  
3.6.9 Marking on container. All of the markings specified in 3.6, except the index point, shall appear on the die  
container/package (e.g., waffle pack, etc.), carrier, unit pack (e.g., individual foil bag), unit container, or multiple carriers (e.g.,  
tubes, rails, magazines) for delivery. For ESD sensitive devices, an industry standard symbol used to identify ESD sensitivity  
(e.g., JESD471 symbol) shall be marked on the carrier or container. However, if all the marking specified above is clearly  
visible on the devices and legible through the unit carrier or multiple carriers, or both, then the ESD marking only (MIL-STD-  
1285) shall be required on the multiple carriers. These requirements apply to the original or repackaged QML microcircuits by  
the manufacturer or distributor.  
3.7 Remarking. QML microcircuits may be remarked provided that all remarking procedures are approved by the TRB.  
Remarking shall be in accordance with 3.6 herein.  
3.8 Screening and test. All microcircuits delivered in accordance with this specification shall meet the screening and testing  
requirements of 4.2 herein whether or not the actual testing has been performed.  
3.9 Technology conformance inspection (TCI). All microcircuits delivered in accordance with this specification shall meet  
the TCI requirements of 4.3 herein whether or not the actual testing has been performed.  
3.9.1 TCI assessment. In the event the TRB determines that the TCI requirements are not met, the TRB shall notify the  
Qualifying Activity (QA) immediately, a list of the product shall be generated by the TRB, and the qualifying activity shall be  
notified of the decision.  
3.10 Solderability. All parts shall be capable of passing the solderability test in accordance with TM 2003 of MIL-STD-  
883, on delivery.  
3.11 Traceability. Traceability to the wafer lot level (for GaAs to wafer level) shall be provided for all delivered microcircuits.  
Traceability includes, as a minimum, the completion of each step required in design (when applicable), fabrication, assembly,  
test and any applicable qualified rework procedure.  
3.12 ESD control. QML microcircuits shall be handled in accordance with JESD625 or other industry standard practices, to  
safeguard against discharge damage.  
3.13 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable  
materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and  
maintenance requirements, and promotes economically advantageous life cycle costs.  
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