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5962-0422104QUC 参数 Datasheet PDF下载

5962-0422104QUC图片预览
型号: 5962-0422104QUC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 2000000 Gates, 32256-Cell, CMOS, CQFP256, CERAMIC, QFP-256]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX J  
TABLE J-I. End-of-line TCI testing procedure (option 1). 1/  
Table  
TCI requirements  
TCI vehicle  
Actual device  
Interval  
Table III  
Table II  
Table IV  
Table V  
Table C-I  
Group A electrical testing  
Group B testing  
Each inspection lot  
Each inspection lot  
Every 3 months  
Every 6 months  
Each wafer lot  
Actual device  
Group C testing  
SEC or actual device  
SEC or actual device  
Actual device  
Group D testing  
Group E testing  
1/ Each group may contain individual subgroups for the purposes of identifying  
individual tests or groups of tests.  
J.3.11.1 Group A electrical testing. Group A electrical testing shall be satisfied by in-line inspections performed in  
accordance with the applicable procedure of MIL-STD-883 on actual devices.  
J.3.11.2 Group C life tests. Life tests shall be performed on the SEC at intervals set by the TRB in the quality  
management plan.  
J.3.12 Test optimization requirements. The process used by the manufacturer to optimize testing utilizing the best  
commercial practices available while still assuring all performance, quality and reliability requirements herein. All of  
the applicable JEP121 process elements shall be addressed for test optimization. Any screen or TCI test prescribed  
herein may be reduced, modified, moved, or eliminated by the QML manufacturer provided the following  
considerations are addressed as a minimum.  
a. Nodes critical to test outcome, called test critical nodes, have been identified and are in control in  
accordance with TechAmerica EIA557.  
b. Test critical nodes have exhibited sufficient capability to assure low product defect rates.  
c. An understanding and control of assignable causes at test critical nodes.  
d. The long term reliability of devices remains unaffected or is improved.  
e. Low defect rates in the process and delivered product are maintained.  
f.  
Measurements taken for out of control conditions along with corrective actions are recorded and this data is  
maintained for a time period consistent with data retention requirements herein.  
g. Method and frequency for revalidation of optimized tests shall be defined in the manufacturer’s  
documentation.  
The manufacturer is expected to maintain the established process control and evaluate the effect on quality and  
reliability of any out of control conditions that may exist at critical nodes. The manufacturer shall also evaluate if a  
relationship exists between any optimized test and any field failure returns, take appropriate corrective actions, and  
report this information as part of the TRB status reports. Regardless of testing modifications, the manufacturer shall  
supply product capable of passing any screening or TCI/QCI test prescribed herein. As a part of the QML philosophy  
and the conversion of customer requirements the manufacturer shall communicate variations in screening, end-of-line  
testing with customers as appropriate. This information shall be available from the manufacturer and to the QA.  
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