MIL-PRF-38535K
APPENDIX F
GENERAL PROVISIONS FOR TAPE AUTOMATED BONDED MICROCIRCUITS
F.1 SCOPE
F.1.1 Scope. This appendix contains provisions for tape automated bonded (TAB) microcircuits. It provides
design guidelines, in-process controls, screening and technology conformance inspection (TCI) requirements, and
general manufacturing guidelines in order to produce a compliant TAB microcircuit. It is intended for use in
conjunction with a manufacturer's compliancy program. This appendix is a mandatory part of the specification. The
information contained herein is intended for compliance. However, for QML microcircuits the manufacturers may
offer approved alternatives that demonstrate a process control system that achieves at least the same level of quality
and reliability as could be achieved by this appendix.
F.2 APPLICABLE DOCUMENTS
F.2.1 General. The documents listed in this section are specified in sections F.3 or F.4 of this appendix. This
section does not include documents cited in other sections of this appendix or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections F.3 and F.4 of this
appendix, whether or not they are listed.
F.2.2 Government documents.
F.2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
- Test Method Standard Microcircuits.
(Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
F.2.3 Non-Government publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JESD22-A101
JESD22-A112
J-STD-020D.01
- Steady-State Temperature Humidity Bias Life Test.
- Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices.
- Joint IPC/JEDEC Standard for Moisture/Reflow Sensitivity Classification For
Nonhermetic Solid State Surface Mount Devices.
(Copies of these documents are available online at http://www.jedec.org or from JEDEC – Solid State Technology
Association, 3103 North 10th Street, Suite 240–S, Arlington, VA 22201-2107.)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational
services.)
F.2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein (except for related specification sheets), the text of this
document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
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ACTEL [ Actel Corporation ]
