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5962-0422103QXC 参数 Datasheet PDF下载

5962-0422103QXC图片预览
型号: 5962-0422103QXC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 2000000 Gates, 32256-Cell, CMOS, CQFP352, CERAMIC, QFP-352]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX A  
A.4.3.3.1 Resubmission of failed lots. Resubmitted lots shall be kept separate from new lots and shall be clearly  
identified as resubmitted lots. When any lot submitted for qualification or quality conformance inspection fails any  
subgroup requirement of group B, C, or D (and E if applicable) tests, it may be resubmitted once for that particular  
subgroup using tightened inspection criteria (as defined in D.4.2). Resubmission for group A inspection failure is not  
permitted. In case of group B, subgroup B-2a failure, the entire lot may be remarked as defined in A.3.6.13. The  
remarked lot shall not be acceptable for alternate group B (class level B only) coverage of a standard lot (see  
A.4.5.8.2 for recovery). For fixed sample size subgroups, lots may be resubmitted one time only at double the  
sample size with zero failures allowed. All submissions shall be subject to the sampling requirements of A.4.3.2. A  
second resubmission (class level S lots shall be resubmitted one time only) using a second tightened inspection  
criteria is permitted only if failure analysis is performed to determine the mechanism of failure for each failed  
microcircuit from the prior submissions and it is determined that failure(s) is (are) due to:  
a. A defect that can be effectively removed by rescreening or reworking the entire lot (see A.3.7.1).  
b. Random type defects which do not reflect poor basic device design or poor basic processing procedures.  
In all instances where analysis of the failed devices indicates that the failure mechanism is due to poor basic  
processing procedures, a basic design fault or non-screenable defects, the lot shall not be resubmitted.  
A.4.3.4 Test method deviation. Deviations from test methods or test circuits specified are allowed provided that it  
is demonstrated to the preparing activity that such deviations in no way relax the requirements of this appendix and  
that they are approved by the preparing activity before testing is performed. The preparing activity shall be notified by  
the device manufacturer of any proposed test method deviation. For proposed electrical test deviations, schematic  
wiring diagrams of the test equipment shall be made available for review.  
A.4.3.5 Procedure in case of test equipment failure or operator error. Whenever a microcircuit is believed to have  
failed as a result of faulty test equipment or operator error, unless otherwise specified in the test method, the failure  
shall be entered in the test record which shall be retained for review along with a complete explanation verifying why  
the failure is believed to be invalid.  
NOTE: ESD failures shall be counted as rejects and not be attributed to equipment/operator error for screening,  
group A, and end-point electrical tests of TM 5005 of MIL-STD-883.  
A.4.3.5.1 Procedure for sample tests. When it has been established that a failure is due to test equipment failure  
or operator error and it has been established that the product has not been damaged or degraded, a replacement  
microcircuit from the same inspection lot may be added to the sample. The replacement microcircuit shall be  
subjected to all those tests to which the discarded microcircuit was subjected prior to its failure and to any remaining  
specified tests to which the discarded microcircuit was not subjected prior to its failure. The manufacturer, at their  
own risk, has the option of replacing the failed microcircuit and continuing with the tests before the validity of the test  
equipment failure or operator error has been established.  
A.4.3.5.2 Procedure for screening tests. When it has been established that lot failure(s) during screening test(s)  
are due to operator or equipment error and it has been established that the remaining product has not been damaged  
or degraded, the lot or surviving portion of the lot, as the case may be, may be resubmitted to the corrected screening  
tests(s) in which the error occurred. Failures verified as having been caused by test equipment failure or operator  
error shall not be counted in the PDA calculation (when applicable).  
A.4.3.5.3 Failure and corrective action reports. When the procedures of A.4.3.5.1 and A.4.3.5.2 are utilized in  
continuing sample tests or resubmitting lots for screening tests, the manufacturer shall document the results of their  
failure investigations and corrective actions and shall make this information available to the Government Quality  
Assurance Representative (QAR), the acquiring activity, or the qualifying activity, as applicable.  
A.4.3.6 Electrical test equipment verification. The manufacturer shall verify the measurement/operation  
characteristics of the electrical test equipment in accordance with 4.5 of MIL-STD-883.  
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