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5962-0422103QXC 参数 Datasheet PDF下载

5962-0422103QXC图片预览
型号: 5962-0422103QXC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 2000000 Gates, 32256-Cell, CMOS, CQFP352, CERAMIC, QFP-352]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX A  
A.3.5.5.3 Internal lead wires. Internal lead wires or other conductors which are not in thermal contact with a  
substrate along their entire length (such as wire or ribbon conductors) shall be designed to experience, at maximum  
rated current, a continuous current for direct current, or a root mean square (RMS) current (peak current divided by  
√2), for alternating or pulsed current, not to exceed the values established by the following relationship:  
I = Kd 3/2  
Where: I = Maximum allowed current in amperes.  
d = Diameter in inches for round wire (or equivalent round wire diameter which would provide the  
same cross-sectional area for other than round wire internal conductor).  
K = A constant taken from table A-IA below for the applicable wire or conductor length and  
composition used in the device.  
Composition  
"K" values for bond-to-bond total conductor length  
Length > 0.040 inch (0.10 cm)  
Length 0.040 inch (0.10 cm)  
Aluminum  
Gold  
Copper  
Silver  
22,000  
30,000  
30,000  
15,000  
9,000  
15,200  
20,500  
20,500  
10,500  
6,300  
All other  
A.3.5.5.4 Verification of glassivation layer integrity. Where the current density of aluminum metallization for a  
device type to be qualified exceeds the allowable current density for unglassivated aluminum, the device type shall be  
subjected to and pass the requirements of TM 2021 of MIL-STD-883 prior to qualification and the glassivation layer  
integrity sample used along with and a photograph of the etched die shall be documented and maintained. One  
resubmission is permitted at twice the sample size. Unless otherwise specified by the qualifying activity (QA), the  
device type shall be tested after sealing (or after exposure to the time/temperature sealing profile) in the package  
type that receives the highest temperature range during sealing for which the device type is to be qualified. Changes  
in design, materials, or process, which affect current density or glassivation, shall also be evaluated using TM 2021 of  
MIL-STD-883. This evaluation applies only when the current density requirements for unglassivated aluminum are  
exceeded.  
A.3.5.6 Package element material and finish.  
A.3.5.6.1 Package material. Package body material shall be metal, glass, or ceramic in accordance with A.3.5.1.  
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