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5962-0422103QXC 参数 Datasheet PDF下载

5962-0422103QXC图片预览
型号: 5962-0422103QXC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 2000000 Gates, 32256-Cell, CMOS, CQFP352, CERAMIC, QFP-352]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX A  
A.3.1.2 Conflicting requirements. In the event of conflict between the requirements of this appendix, this  
specification and other requirements of the applicable device specification, the precedence in which requirements  
shall govern, in descending order, is as follows:  
a. Applicable device specification or drawing.  
b. This appendix.  
c. Specifications, standards, and other documents referenced in A.2.2 and A.2.3.  
A.3.1.3 Terms, definitions, symbols and requirements. For the purpose of this appendix, the terms, definitions,  
and symbols of MIL-STD-883 and MIL-HDBK-1331, and those contained herein shall apply and shall be used in the  
applicable device specifications or drawings wherever they are pertinent. The definitions of part, subassembly,  
assembly, unit, group, set, and system, as well as the ancillary terms accessory and attachment are contained in  
MIL-HDBK-505. To further define a particular type of microcircuit, additional modifiers may be prefixed.  
A.3.1.3.1 Microelectronics. The area of electronic technology associated with or applied to the realization of  
electronic systems from extremely small electronic parts or elements.  
A.3.1.3.2 Element (of a microcircuit or integrated circuit). A constituent of the microcircuit, or integrated circuit, that  
contributes directly to its operation. (e.g., A discrete part incorporated into a microcircuit becomes an element of the  
microcircuit.)  
A.3.1.3.3 Substrate (of a microcircuit or integrated circuit). The supporting material upon or within which the  
elements of a microcircuit or integrated circuit are fabricated or attached.  
A.3.1.3.4 Integrated circuit (microcircuit) . A small circuit having a high equivalent circuit element density, which is  
considered as a single part composed of interconnected elements on or within a single substrate to perform an  
electronic circuit function. (e.g., This excludes printed wiring boards, circuit card assemblies, and modules composed  
exclusively of discrete electronic parts.)  
A.3.1.3.4.1 Multichip microcircuit. An integrated circuit or microcircuit consisting of elements formed on or within  
two or more semiconductor chips which are separately attached to a substrate or package.  
A.3.1.3.4.2 Hybrid microcircuit. A microcircuit consisting of elements that are a combination of the film microcircuit  
type (see A.3.1.3.4.4) and the semiconductor types (see A.3.1.3.4.1 and A.3.1.3.4.3) or a combination of one or both  
of the types with discrete parts.  
A.3.1.3.4.3 Monolithic microcircuit (or integrated circuit). A microcircuit consisting exclusively of elements formed  
in situ on or within a single semiconductor substrate with at least one of the elements formed within the substrate.  
A.3.1.3.4.4 Film microcircuit (or film integrated circuit). A microcircuit consisting exclusively of elements which are  
films formed in situ upon an insulating substrate.  
A.3.1.3.5 Microcircuit module. An assembly of microcircuits or an assembly of microcircuits and discrete parts,  
designed to perform one or more electronic circuit functions, and constructed such that for the purposes of  
specification testing, commerce, and maintenance, it is considered indivisible.  
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