MIL-PRF-38535K
APPENDIX A
A.3.1.3.6 Production lot. A production lot shall consist of devices manufactured on the same production line(s) by
means of the same production technique, materials, controls, and design. Where a production lot identification is
terminated upon completion of wafer or substrate processing, or at any later point prior to device sealing, it shall be
permissible to process more than a single device type in a single production lot provided traceability is maintained by
assembling devices into inspection lots, as defined herein, at the point where production lot identification is
terminated.
A.3.1.3.7 Inspection lot - class level S. An inspection lot for class level S microcircuits shall consist of a single
device type from a single wafer lot in a single package type and lead finish unless otherwise specified in the QM plan.
With qualifying activity approval, a maximum of 4 wafer lots may be used to form a class level S inspection lot. All
devices shall be sealed within a single week. All assembly operations from die mounting through package sealing
shall be completed within the same 6-week period. Each inspection sublot shall be uniquely identified to maintain
traceability of that sublot from the wafer lot to the inspection lot (see A.3.4.6 and A.4.3.3).
A.3.1.3.8 Inspection lot - class level B. A quantity of microcircuits submitted at one time for inspection to determine
compliance with the requirements and acceptance criteria of the applicable device specification. Each inspection lot
shall consist of microcircuits of a single device type, in a single package type and lead finish. Each inspection lot
shall be manufactured on the same production lines through final seal by the same production techniques and sealed
within the same period not exceeding 6 weeks. Inspection lot identification shall be maintained from the time the
inspection lot is formed through the time the lot is accepted, and shall be traceable to the production lot(s) from which
the inspection lot was formed (see A.3.4.6 and A.4.3.3).
A.3.1.3.9 Inspection sublot - class level S. An inspection sublot for class level S microcircuits shall be a division
(one wafer lot maximum) of parts in an inspection lot into smaller quantities of parts (see A.4.5.2 herein).
A.3.1.3.10 Inspection lot split - class level B. A class level B inspection lot split shall be a further division of the
number of parts in an inspection lot into smaller quantities of parts (see A.4.5.2 herein).
A.3.1.3.11 Wafer lot. A wafer lot consists of microcircuit wafers formed into a lot at the start of wafer fabrication for
homogeneous processing as a group, and assigned a unique identifier or code to provide traceability, and maintain
lot integrity throughout the fabrication process (see A.4.3.3 herein).
A.3.1.3.12 Package type. A package with a unique case outline (see MIL-STD-1835), configuration, materials
(including bonding wire and die attach), piece parts (excluding pre-forms which differ only in size), and assembly
processes.
A.3.1.3.13 Microcircuit group. Microcircuits which are designed to perform the same type of basic circuit function
(e.g., for linear: Amplifier, comparator, sense amplifier, regulator, etc.; for digital: Logic gate buffer, flip-flop,
combinational gate, sequential register/counter) within a given circuit technology (e.g., diode transistor logic (DTL),
non-Schottky transistor transistor logic (TTL), emitter coupled logic (ECL), Schottky TTL, linear, hybrid, metal oxide
semiconductor(MOS)) which are designed for the same supply, bias and signal voltages and for input-output
compatibility and which are fabricated by use of the same basic die construction and metallization; the same die
attach method; and by use of bonding interconnects of the same size, material and attachment method.
A.3.1.3.14 Percent defective allowable (PDA). Percent defective allowable is the maximum observed percent
defective which will permit the lot to be accepted after the specified 100 percent test.
Delta limit (∆)
. The maximum change in a specified parameter reading which will permit a device to be
A.3.1.3.15
accepted on the specified test, based on a comparison of the present measurement with a specified previous
measurement. NOTE: When expressed as a percentage value, it shall be calculated as a proportion of the previous
measured value.
50
ACTEL [ Actel Corporation ]
