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5962-0151801QYC 参数 Datasheet PDF下载

5962-0151801QYC图片预览

型号：	5962-0151801QYC
PDF下载：	下载PDF文件查看货源
内容描述：	[Field Programmable Gate Array, 32000 Gates, 206MHz, 2880-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用：	栅可编程逻辑
文件页数/大小：	217 页 / 1554 K
品牌：	ACTEL [ Actel Corporation ]

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MIL-PRF-38535K

CONTENTS

PARAGRAPH

PAGE

3.6.3.2 JAN or J mark ................................................................................................................................................. 14

3.6.4 Manufacturer's identification............................................................................................................................... 14

3.6.4.1 Code for assembly sites .................................................................................................................................. 14

3.6.5 Country of origin ................................................................................................................................................. 14

3.6.6 Date code ........................................................................................................................................................... 14

3.6.7 Marking location and sequence.......................................................................................................................... 14

3.6.7.1 Beryllium oxide package identifier ................................................................................................................... 14

3.6.7.2 Electrostatic discharge (ESD) sensitivity identifier .......................................................................................... 14

3.6.8 QML marked product ......................................................................................................................................... 15

3.6.9 Marking on container.......................................................................................................................................... 15

3.7 Remarking ............................................................................................................................................................. 15

3.8 Screening and test ................................................................................................................................................ 15

3.9 Technology conformance inspection (TCI) ............................................................................................................ 15

3.9.1 TCI assessment ................................................................................................................................................. 15

3.10 Solderability......................................................................................................................................................... 15

3.11 Traceability .......................................................................................................................................................... 15

3.12 ESD control ......................................................................................................................................................... 15

3.13 Recycled, recovered, or environmentally preferable materials ............................................................................ 15

3.14 Alternate test requirements ................................................................................................................................. 16

3.15 Passive elements ................................................................................................................................................ 16

3.15.1 Capacitors ........................................................................................................................................................ 16

4. VERIFICATION ....................................................................................................................................................... 17

4.1 Verification ............................................................................................................................................................ 17

4.2 Screening .............................................................................................................................................................. 17

4.2.1 Screen testing failures ........................................................................................................................................ 17

4.2.2 Screening resubmission criteria ......................................................................................................................... 17

4.2.3 Electrostatic discharge (ESD) sensitivity ............................................................................................................ 17

4.3 Technology conformance inspection (TCI) ............................................................................................................ 17

4.4 Qualification inspection ......................................................................................................................................... 17

5. PACKAGING ........................................................................................................................................................... 34

5.1 Packaging ............................................................................................................................................................. 34

6. NOTES .................................................................................................................................................................... 34

6.1 Intended use ......................................................................................................................................................... 34

6.1.1 Class T ............................................................................................................................................................... 34

6.2 Acquisition requirements ....................................................................................................................................... 34

6.3 Qualification .......................................................................................................................................................... 34

6.4 Terms and definitions ............................................................................................................................................ 34

6.4.1 Microelectronics ................................................................................................................................................. 34

6.4.2 Element (of a microcircuit or integrated circuit) .................................................................................................. 34

6.4.3 Substrate (of a microcircuit or integrated circuit) ................................................................................................ 35

6.4.4 Integrated circuit (microcircuit) ........................................................................................................................... 35

6.4.4.1 Multichip microcircuit ....................................................................................................................................... 35

6.4.4.2 Monolithic microcircuit ..................................................................................................................................... 35

6.4.4.3 Microcircuit module ......................................................................................................................................... 35

6.4.5 Production lot ..................................................................................................................................................... 35

6.4.6 Inspection lot ...................................................................................................................................................... 35

6.4.7 Wafer lot ............................................................................................................................................................. 35

6.4.8 Percent defective allowable (PDA) ..................................................................................................................... 35

6.4.9 Delta limit ........................................................................................................................................................... 35

6.4.10 Rework ............................................................................................................................................................. 35

6.4.11 Final seal .......................................................................................................................................................... 35

6.4.12 Acquiring activity .............................................................................................................................................. 36

6.4.13 Qualifying activity (QA) ..................................................................................................................................... 36

6.4.14 Parts per million (PPM) .................................................................................................................................... 36

6.4.15 Device type ...................................................................................................................................................... 36

iii

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