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5962-0151801QYC 参数 Datasheet PDF下载

5962-0151801QYC图片预览
型号: 5962-0151801QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 32000 Gates, 206MHz, 2880-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)  
JESD471  
- Symbol & Label for Electrostatic Sensitive Devices.  
JEP121  
- Requirements for Microelectronic Screening and Test Optimization.  
- Accelerated Moisture Resistance - Unbiased Autoclave.  
- Highly Accelerated Temperature and Humidity Stress Test (HAST) - biased  
- Highly Accelerated Temperature and Humidity Stress Test (HAST) - unbiased  
- Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)  
- External Visual.  
JESD22-A102  
JESD22-A110  
JESD22-A118  
JESD22-A114  
JESD22-B101  
JESD31  
- General Requirements for Distributors of Commercial and Military Semiconductor Devices.  
- Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices.  
JESD625  
(Copies of these documents are available online at http://www.jedec.org or from JEDEC – Solid State Technology  
Association, 3103 North 10th Street, Suite 240–S, Arlington, VA 22201-2107.)  
2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this  
document and the references cited herein (except for related specification sheets), the text of this document takes  
precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has  
been obtained.  
3. REQUIREMENTS  
3.1 General. The manufacturer of QML microcircuits in compliance with this specification shall have or have access to and  
use of production and test facilities, and a QM program to assure successful compliance with the provisions of this  
specification. All microcircuits manufactured on a QML line shall be processed on a QA certified fabrication line, and shall be  
assembled on a QA certified assembly line. All microcircuits shall be electrically capable of meeting parameters over the  
specified temperature range in accordance with the device specification in a QA certified test facility. The QML manufacturer  
shall be capable of demonstrating their ability to develop hardware and software test programs before delivery of the product.  
The QML certification mark (3.6.3) indicates compliance to all the performance provisions of this specification. The  
requirements described herein shall be addressed in one of two ways. These are as follows:  
a. As specified herein.  
b. Demonstration to the qualifying activity (QA) and validation team when applicable, of an alternate method, that assures  
at least the same level of quality and reliability as defined by the requirements herein, or demonstration to the QA that  
the requirement is not applicable to the manufacturer's technology.  
NOTE: A QML manufacturer may modify screening and Technology Conformance Inspection (TCI) requirements of the  
device specification or Standard Microcircuit Drawing (SMD) under special criteria defined within this specification and as  
defined in the manufacturer's QM plan. (For guidance on screening and QCI optimization see JEP121 - Requirements for  
Microelectronic Screening and Test Optimization and J.3.12 herein.) These changes cannot affect any thermal, mechanical,  
electrical parameters, or radiation levels (when applicable) which affect form, fit, or function of the device, defined within the  
device specification or SMD.  
3.1.1 Reference to applicable device specification. For purposes of this specification, when the term "as specified" is used  
without additional reference to a specific location or document, the intended reference shall be to the device specification.  
3.2 Item requirements. The individual item requirements, including temperature range, for integrated circuits delivered  
under this specification shall be documented in the device specification prepared in accordance with 3.5 herein. Devices  
produced under this specification may have any operating temperature range (case, ambient, or junction) as long as it is  
specified in the device specification, and any references to minimum or maximum operating temperatures shall refer to the  
respective lower and upper limits of this range. However, the manufacturer shall demonstrate the operating temperature  
range (case, ambient, or junction) capability of the technology being offered. The standard evaluation circuit (SEC) is typically  
used for this demonstration.  
3