TABLE IIB. Delta limits at +25C - Continued.
4/ The binning circuit has two different paths to measure the delay due to antifuse contribution and transistor
contribution. Below shows a simplified schematic of the two binning circuit paths used to measure and characterize
speed grades by comparing to timing models.
The “Bin Path 1 (BIN_FAST)” path is composed of inverter chains to measure the delay due to transistors.
The “Bin Path 2 (BIN_SLOW)” path is mainly composed of metal tracks connected to ground via un-programmed
antifuses to emulate capacitive loading due to antifuses. In addition to the antifuse capacitive loading, the “Bin Path 2”
also has in series to the path, a fixed amount of antifuses that get programmed to emulate delays of programmed
antifuses.
5/ Binning circuit measurement is done by applying stimulus signals through the TDI pin. The stimulus circuit will apply
the necessary signals to toggle one path and output the signal to TDO pin. A formula is extracted by correlating the
measured bin speeds of the two binning circuit paths and the characterization data. For each device, during the
speed grading in the screening process, the BIN_FAST and BIN_SLOW measurement are used by the formula to
determine the speed grade of each part.
4.5 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded
before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical
parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option,
either perform delta measurements or within 24 hours after burn-in perform final electrical parameter tests, subgroups 1, 7,
and 9.
4.6 Programming procedures. Programming support is provided through manufacturer’s Silicon Sculptor 2 and 3 (see 6.7
herein), a single-sited programmer controlled from a PC with manufacturer’s Silicon Sculptor programming software. During
programming, each antifuse is programmed and verified by the programming algorithm to ensure correct programming. At the
end of the programming, there are integrity tests to ensure that programming is completed properly. The programming
procedure is specified by the manufacturer and available at manufacturer’s website. The programming procedures shall be
maintained by the manufacturer and shall be made available to the preparing or acquiring activity upon request.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
SIZE
STANDARD
5962-04221
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
C
49
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
