3.2 x 1.60 x 1.6mm
3.5 x 2.80 x 1.9mm
2.0 x 1.25 x 1.1mm
Solid Tantalum Chip Capacitor
ATCC-211(A, B, P) Series
RoHS
Pb
Compliant
OUTLINE DIMENSIONS:
Recommended Land Pattern
Dimension
L
W
H
F(±0.10)
S(±0.30)
A
B
C
Code
P
A
B
2.0±0.15
3.2±0.20
3.5±0.2
1.25±0.15
1.6±0.20
2.8±0.2
1.1±0.15
1.6±0.20
1.9±0.2
0.9
1.2
2.2
0.5
0.8
0.8
1.1
1.1
1.4
1.05
1.35
1.35
1.2
1.5
2.7
Dimensions: mm
Materials
*The Case is black molded
REFLOW PROFILE:
∆ Preheat condition: 150 ~200˚C /60~120sec.
∆ Allowed time above 217˚C: 60~90sec.
∆ Max temp: 260˚C
∆ Max time at max temp: 10sec.
∆ Solder paste: Sn/3.0Ag/0.5Cu
∆ Allowed Reflow time: 2x max
Visit www.abracon.com for Terms & Conditions of Sale
Revised: 12.22.12
ABRACON IS
ISO9001:2008
CERTIFIED
30332 Esperanza, Rancho Santa Margarita, California92688
tel 949-546-8000 | fax 949-546-8001| www.abracon.com
ABRACON [ ABRACON ]
