AB08XX Series
Real Time Clock Module
ESD Sensitive
Date of Issue: Sept. 10th, 2012
3.0 x 3.0 mm
Page (5) of (12)
Revision #: Initial Release
Abracon Drawing #
5. Electrical Specifications
5.1 Absolute Maximum Ratings
All voltages referenced to VSS.
SYMBOL
VCC
VBAT
VI
PARAMETER
System Power Voltage
Battery Voltage
Input voltage
TEST CONDITIONS
MIN
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-1
TYP
MAX
3.6
UNIT
V
3.6
V
VCC > VMIN
VCC < VMIN, VBAT > VMIN
VCC > VMIN
VCC + 0.3
VBAT + 0.3
VCC + 0.3
VBAT + 0.3
1
V
Input voltage
V
VI
VO
VO
II
Output voltage
Output voltage
Input current
V
VCC < VMIN, VBAT > VMIN
V
mA
mA
V
Output current
-1
1
IO
CDM
HBM
±500
ESD Voltage
VESD
±4000
100
V
Latch-up Current
Storage Temperature
Operating Temperature
mA
°C
°C
ILU
TSTG
TOP
-65
-40
150
85
Hand soldering for 10
seconds
Reflow profile per JEDEC
J-STD-020D
Lead temperature
300
260
°C
°C
TSLD
TREF
Reflow soldering
temperature
5.2 Operating Parameters
TA = -40 °C to 85 °C, TYP values at 25 °C
SYMBOL
VCC
PARAMETER
System Power Voltage
Battery Voltage
TEST CONDITIONS
SPI or I2C active
Clock operating + RAM
Clock operating + RAM
VCC = 3.0V
MIN
1.7
TYP
MAX
3.6
UNIT
V
V
V
1.5
3.6
1.5
3.6
VBAT
VT+
1.5
1.1
Positive-going Input
Threshold Voltage
V
V
VCC = 1.8V
VCC = 3.0V
0.9
Negative-going Input
Threshold Voltage
VT-
VCC = 1.8V
0.6
Low level output voltage
1.7V < VCC < 3.6V
VSS
0.2•VCC
V
V
V
VOL
VOH
VMIN
High level output voltage
on push-pull outputs
1.7V < VCC < 3.6V
0.8•VCC
VCC
Power supply valid voltage
1.5
ABRACON [ ABRACON ]
